Malaquias P, Gutierrez M F, Hass V, Stanislawczuk R, Bandeca M C, Arrais Cag, Farago P V, Reis A, Loguercio A D
Oper Dent. 2018 Mar/Apr;43(2):201-212. doi: 10.2341/16-333-L.
To evaluate the effects of addition of diacetate chlorhexidine (CHX) at different concentrations into two etch-and-rinse adhesive systems on CHX release, as well as the immediate (IM) and two-year (2-Y) resin-dentin microtensile bond strength (μTBS) and nanoleakage (NL).
CHX was added to XP Bond (XP) and Ambar (AM) at concentrations of 0.0 wt% (control); 0.01 wt%; 0.05 wt%; and 0.1 to 0.2 wt%. To assess the cumulative CHX release, adhesive disks were made in a metallic matrix and after light-curing were stored in water. Ultraviolet spectrophotometric measurements of the storage solution were performed to examine the release kinetics of CHX. For μTBS and NL, the occlusal enamel of molars was removed and the adhesives were applied to the dentin surface after acid etching. After composite resin build-up, specimens were sectioned to obtain μTBS sticks. The specimens were subjected to μTBS and NL at IM and after 2-Y. In addition, specimens underwent examination for CHX using micro-Raman spectroscopy. All data were submitted to statistical analysis (α=0.05).
With regard to CHX release, AM showed a slower and gradual release of CHX while XP released CHX more quickly ( p<0.05), and CHX was still present in the hybrid layers after 2-Y. Both adhesives showed CHX release at 2-Y water storage. Both CHX-containing adhesives showed higher μTBS values than did the control group ( p<0.05).
评估在两种酸蚀冲洗粘结系统中添加不同浓度的双醋酸氯己定（CHX）对CHX释放的影响，以及即刻（IM）和两年（2-Y）的树脂-牙本质微拉伸粘结强度（μTBS）和纳米渗漏（NL）。
将CHX以0.0 wt%（对照组）、0.01 wt%、0.05 wt%以及0.1至0.2 wt%的浓度添加到XP Bond（XP）和Ambar（AM）中。为评估CHX的累积释放，在金属模具中制作粘结盘，光固化后储存在水中。对储存溶液进行紫外分光光度测量以检测CHX的释放动力学。对于μTBS和NL，去除磨牙的咬合面釉质，酸蚀后将粘结剂应用于牙本质表面。复合树脂充填后，将标本切片以获得用于μTBS测试的小棒。在即刻和2年后对标本进行μTBS和NL测试。此外，使用显微拉曼光谱对标本进行CHX检测。所有数据均进行统计分析（α = 0.05）。
关于CHX释放，AM显示CHX释放较慢且呈逐渐释放，而XP释放CHX更快（p < 0.05），并且2年后混合层中仍存在CHX。两种粘结剂在储存2年的水中均有CHX释放。两种含CHX的粘结剂均显示出比对照组更高的μTBS值（p < 0.05）。
