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酵母中的剪接体组装

Spliceosome assembly in yeast.

作者信息

Cheng S C, Abelson J

机构信息

Division of Biology, California Institute of Technology, Pasadena 91125.

出版信息

Genes Dev. 1987 Nov;1(9):1014-27. doi: 10.1101/gad.1.9.1014.

Abstract

Precursors to mRNA become substrates for splicing by being assembled into a complex multisubunit structure, the spliceosome. To study the assembly of the yeast spliceosome, intermediate complexes were separated by electrophoresis on nondenaturing polyacrylamide gels. Four splicing-dependent complexes, A1, A2-1, A2-2, and B, were observed. The order of assembly of these complexes was determined to be B----A2-1----A1----A2-2. The assembly process can be blocked at complex A1 by addition of 5 mM EDTA or by carrying out the assembly process in heat-inactivated rna2 extracts. The snRNA composition of the complexes was determined by hybridization with probes for five yeast snRNAs. snR14 (U4) was only found in complex A2-1, snR6 (U6) and snR7 (U5) were in complexes A1, A2-1, and A2-2, whereas snR20 (U2) was in all four of the complexes. snR19 (U1) was not present in any of the complexes. Hybridization with these probes was also employed to detect snRNPs present in yeast splicing extracts. We found that snR6, snR7, and snR14 were present together in a large complex. This complex underwent an ATP-dependent dissociation to give snR7 and snR6-snR14 complexes. snR19 and snR20 are present in distinct RNPs but the mobility of these is not affected by ATP. A mechanism for spliceosome assembly is proposed.

摘要

信使核糖核酸(mRNA)的前体通过组装成一个复杂的多亚基结构——剪接体,成为剪接的底物。为了研究酵母剪接体的组装过程,在非变性聚丙烯酰胺凝胶上通过电泳分离中间复合物。观察到四种依赖剪接的复合物,即A1、A2 - 1、A2 - 2和B。确定这些复合物的组装顺序为B→A2 - 1→A1→A2 - 2。通过添加5 mM乙二胺四乙酸(EDTA)或在热灭活的rna2提取物中进行组装过程,组装过程可以在复合物A1处被阻断。通过与五种酵母小核核糖核酸(snRNA)的探针杂交来确定复合物的snRNA组成。snR14(U4)仅在复合物A2 - 1中被发现,snR6(U6)和snR7(U5)存在于复合物A1、A2 - 1和A2 - 2中,而snR20(U2)存在于所有四种复合物中。snR19(U1)在任何复合物中均不存在。还利用与这些探针的杂交来检测酵母剪接提取物中存在的小核核糖核蛋白颗粒(snRNP)。我们发现snR6、snR7和snR14共同存在于一个大复合物中。该复合物经历了依赖三磷酸腺苷(ATP)的解离,产生snR7和snR6 - snR14复合物。snR19和snR20存在于不同的核糖核蛋白颗粒中,但它们的迁移率不受ATP的影响。提出了一种剪接体组装的机制。

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