J Adhes Dent. 2018;20(2):151-164. doi: 10.3290/j.jad.a40302.
To evaluate the effects on the surface properties (morphology, roughness, microhardness, composition) and bond strength to composite of four types of base cements (Equia-Fil/EQF, Angelus white MTA/MTA, Biodentin/BDN and IRM/IRM) when treated with phosphoric acid etching (PAE) or two self-etch adhesives (Select One Prime & Bond and Clearfil S3 Bond).
Disk-shaped specimens were prepared and stored until complete setting. The surfaces before and after treatments were examined by stereomicroscopy, optical profilometry, ATR-FTIR, and LV-SEM/EDX. Interfacial bond strength with composite was evaluated under shear loading (SBS) using a conventional bonding resin (Heliobond) on silane treated (SIL) specimens as a reference. Failure mode was evaluated using stereomicroscopy.
PAE induced compositional changes on MTA and BDN, forming a phosphate-rich surface layer, probably composed of Ca-P salts. Dissolution of the amorphous cement fractions was evident in all materials. SPB and CSB did not show remarkable changes apart from an increase in Si content on MTA. On all bases, PAE resulted in the highest values for most of the roughness parameters. SPB and CSB showed lower or equal average roughness (Sa) and percentage of additional surface area contributed by the texture (Sdr) compared to the control in MTA and EQL. In terms of SBS, the highest β (Weibull shape parameter) in MPa were MTA-SIL = 5.79, BDN-PAE = 3.67, and MTA-PAE = 3.46, whereas the highest α (Weibull scale parameter) were EQF-CSB = 9.08, BDN-PAE = 5.13, and BDN-SIL = 4.67. Adhesive failures with less than 20% of the bonding area were encountered in IRM-PAE and SIL, EQF-CBS and MTA-SIL.
Each base material requires a different procedure for optimal bonding with composite. Phosphoric acid etching and application of the conventional bonding resin Heliobond is the preferred procedure for composite bonding to MTA, BDN, IRM, but for composite bonding to CSB for EQF, the mild self-etch adhesive is preferable.
评估磷酸酸蚀（PAE）或两种自酸蚀粘结剂（Select One Prime & Bond 和 Clearfil S3 Bond）处理 4 种基质粘结剂（Equia-Fil/EQF、Angelus white MTA/MTA、Biodentin/BDN 和 IRM/IRM）对其表面性能（形貌、粗糙度、显微硬度、成分）和与复合树脂粘结强度的影响。
制备圆盘状试件并储存至完全凝固。用立体显微镜、光学轮廓仪、ATR-FTIR 和 LV-SEM/EDX 检测处理前后的表面。用传统粘结树脂（Heliobond）在硅烷处理（SIL）标本上评估与复合树脂的界面粘结强度（SBS）作为参考。用立体显微镜评估失效模式。
PAE 导致 MTA 和 BDN 发生成分变化，形成富含磷酸盐的表面层，可能由 Ca-P 盐组成。所有材料的无定形水泥部分都有明显的溶解。SPB 和 CSB 除 MTA 中 Si 含量增加外，没有明显变化。在所有基底上，PAE 使大多数粗糙度参数值最高。与对照相比，SPB 和 CSB 在 MTA 和 EQL 中表现出较低或相等的平均粗糙度（Sa）和纹理增加的表面积百分比（Sdr）。就 SBS 而言，MPa 下最高的 β（Weibull 形状参数）为 MTA-SIL = 5.79、BDN-PAE = 3.67 和 MTA-PAE = 3.46，而最高的 α（Weibull 规模参数）为 EQF-CSB = 9.08、BDN-PAE = 5.13 和 BDN-SIL = 4.67。IRM-PAE 和 SIL、EQF-CBS 和 MTA-SIL 的粘结面积小于 20%的粘结发生了粘结失效。
每种基底材料都需要不同的程序来实现与复合树脂的最佳粘结。磷酸酸蚀和传统粘结树脂 Heliobond 的应用是 MTA、BDN、IRM 与复合树脂粘结的首选程序，但对于 CSB 与 EQF 的复合树脂粘结，较温和的自酸蚀粘结剂是优选的。
