Fan Ching-Lin, Tseng Fan-Ping, Tseng Chiao-Yuan
Department of Electronic Engineering, National Taiwan University of Science and Technology, 43 Section 4, Keelung Road, Taipei 106, Taiwan.
Graduate Institute of Electro-Optical Engineering, National Taiwan University of Science and Technology, 43 Section 4, Keelung Road, Taipei 106, Taiwan.
Materials (Basel). 2018 May 17;11(5):824. doi: 10.3390/ma11050824.
In this work, amorphous indium-gallium-zinc oxide thin-film transistors (a-IGZO TFTs) with a HfO₂ gate insulator and CF₄ plasma treatment was demonstrated for the first time. Through the plasma treatment, both the electrical performance and reliability of the a-IGZO TFT with HfO₂ gate dielectric were improved. The carrier mobility significantly increased by 80.8%, from 30.2 cm²/V∙s (without treatment) to 54.6 cm²/V∙s (with CF₄ plasma treatment), which is due to the incorporated fluorine not only providing an extra electron to the IGZO, but also passivating the interface trap density. In addition, the reliability of the a-IGZO TFT with HfO₂ gate dielectric has also been improved by the CF₄ plasma treatment. By applying the CF₄ plasma treatment to the a-IGZO TFT, the hysteresis effect of the device has been improved and the device's immunity against moisture from the ambient atmosphere has been enhanced. It is believed that the CF₄ plasma treatment not only significantly improves the electrical performance of a-IGZO TFT with HfO₂ gate dielectric, but also enhances the device's reliability.
在这项工作中,首次展示了具有HfO₂栅极绝缘体并经过CF₄等离子体处理的非晶铟镓锌氧化物薄膜晶体管(a-IGZO TFT)。通过等离子体处理,具有HfO₂栅极电介质的a-IGZO TFT的电学性能和可靠性均得到改善。载流子迁移率显著提高了80.8%,从30.2 cm²/V∙s(未处理)提高到54.6 cm²/V∙s(经过CF₄等离子体处理),这是因为掺入的氟不仅为IGZO提供了一个额外的电子,还钝化了界面陷阱密度。此外,经过CF₄等离子体处理后,具有HfO₂栅极电介质的a-IGZO TFT的可靠性也得到了提高。通过对a-IGZO TFT应用CF₄等离子体处理,器件的滞后效应得到改善,并且器件对周围大气中水分的耐受性得到增强。据信,CF₄等离子体处理不仅显著提高了具有HfO₂栅极电介质的a-IGZO TFT的电学性能,还增强了器件的可靠性。