Walsh Lee A, Green Avery J, Addou Rafik, Nolting Westly, Cormier Christopher R, Barton Adam T, Mowll Tyler R, Yue Ruoyu, Lu Ning, Kim Jiyoung, Kim Moon J, LaBella Vincent P, Ventrice Carl A, McDonnell Stephen, Vandenberghe William G, Wallace Robert M, Diebold Alain, Hinkle Christopher L
Department of Materials Science and Engineering , University of Texas at Dallas , Richardson , Texas 75080 , United States.
Tyndall National Institute, University College Cork , Lee Maltings Complex , Cork T12R5CP , Ireland.
ACS Nano. 2018 Jun 26;12(6):6310-6318. doi: 10.1021/acsnano.8b03414. Epub 2018 Jun 8.
The topologically protected surface states of three-dimensional (3D) topological insulators have the potential to be transformative for high-performance logic and memory devices by exploiting their specific properties such as spin-polarized current transport and defect tolerance due to suppressed backscattering. However, topological insulator based devices have been underwhelming to date primarily due to the presence of parasitic issues. An important example is the challenge of suppressing bulk conduction in BiSe and achieving Fermi levels ( E) that reside in between the bulk valence and conduction bands so that the topologically protected surface states dominate the transport. The overwhelming majority of the BiSe studies in the literature report strongly n-type materials with E in the bulk conduction band due to the presence of a high concentration of selenium vacancies. In contrast, here we report the growth of near-intrinsic BiSe with a minimal Se vacancy concentration providing a Fermi level near midgap with no extrinsic counter-doping required. We also demonstrate the crucial ability to tune E from below midgap into the upper half of the gap near the conduction band edge by controlling the Se vacancy concentration using post-growth anneals. Additionally, we demonstrate the ability to maintain this Fermi level control following the careful, low-temperature removal of a protective Se cap, which allows samples to be transported in air for device fabrication. Thus, we provide detailed guidance for E control that will finally enable researchers to fabricate high-performance devices that take advantage of transport through the topologically protected surface states of BiSe.
三维(3D)拓扑绝缘体的拓扑保护表面态,通过利用其特定属性,如自旋极化电流传输以及因背散射抑制而具备的缺陷容忍能力,对于高性能逻辑和存储器件而言具有变革潜力。然而,迄今为止基于拓扑绝缘体的器件表现平平,主要原因在于存在寄生问题。一个重要的例子是,在BiSe中抑制体传导以及实现位于体价带和导带之间的费米能级(E)面临挑战,这样拓扑保护表面态才能主导输运。文献中绝大多数关于BiSe的研究报告称,由于存在高浓度的硒空位,材料呈现强n型且费米能级位于体导带中。相比之下,我们在此报告了近乎本征的BiSe的生长情况,其硒空位浓度极低,无需外部反掺杂即可提供接近带隙中间的费米能级。我们还展示了通过生长后退火控制硒空位浓度,将费米能级从带隙中间以下调至导带边缘附近带隙上半部分的关键能力。此外,我们展示了在小心低温去除保护性硒帽后仍能维持这种费米能级控制的能力,这使得样品能够在空气中运输以用于器件制造。因此,我们提供了关于费米能级控制的详细指导,最终将使研究人员能够制造出利用BiSe拓扑保护表面态进行输运的高性能器件。