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两步法 breakdown 氮化硅薄膜用于纳米孔制备:薄部分的形成和穿透。

Two-step breakdown of a SiN membrane for nanopore fabrication: Formation of thin portion and penetration.

机构信息

Hitachi Ltd., Research & Development Group, Center for Technology Innovation - Healthcare, 1-280, Higashi-koigakubo, Kokubunji, Tokyo, 185-8603, Japan.

出版信息

Sci Rep. 2018 Jul 4;8(1):10129. doi: 10.1038/s41598-018-28524-5.

Abstract

For the nanopore sensing of various large molecules, such as probe-labelled DNA and antigen-antibody complexes, the nanopore size has to be customized for each target molecule. The recently developed nanopore fabrication method utilizing dielectric breakdown of a membrane is simple and quite inexpensive, but it is somewhat unsuitable for the stable fabrication of a single large nanopore due to the risk of generating multiple nanopores. To overcome this bottleneck, we propose a new technique called "two-step breakdown" (TSB). In the first step of TSB, a local conductive thin portion (not a nanopore) is formed in the membrane by dielectric breakdown. In the second step, the created thin portion is penetrated by voltage pulses whose polarity is opposite to the polarity of the voltage used in the first step. By applying TSB to a 20-nm-thick SiN membrane, a single nanopore with a diameter of 21-26 nm could be fabricated with a high yield of 83%.

摘要

为了对各种大型分子(如标记有探针的 DNA 和抗原-抗体复合物)进行纳米孔传感,必须针对每个目标分子对纳米孔尺寸进行定制。最近开发的利用膜的介电击穿来制造纳米孔的方法简单且相当便宜,但由于存在产生多个纳米孔的风险,因此不太适合稳定制造单个大纳米孔。为了克服这一瓶颈,我们提出了一种称为“两步击穿”(TSB)的新技术。在 TSB 的第一步中,通过介电击穿在膜中形成局部导电的薄部分(不是纳米孔)。在第二步中,通过施加极性与第一步中使用的电压极性相反的电压脉冲来穿透所创建的薄部分。通过将 TSB 应用于 20nm 厚的 SiN 膜,可以以 83%的高产量制造出直径为 21-26nm 的单个纳米孔。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a879/6031669/0b58f7be7fc9/41598_2018_28524_Fig1_HTML.jpg

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