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预测三维立方结构ThTaN中应变介导的拓扑相变。

Predicting the strain-mediated topological phase transition in 3D cubic ThTaN.

作者信息

Zhang Chunmei, Du Aijun

机构信息

School of Chemistry, Physics and Mechanical Engineering, Queensland University of Technology, Gardens Point Campus, QLD 4001, Brisbane, Australia.

出版信息

Beilstein J Nanotechnol. 2018 May 11;9:1399-1404. doi: 10.3762/bjnano.9.132. eCollection 2018.

DOI:10.3762/bjnano.9.132
PMID:29977674
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC6009352/
Abstract

The cubic ThTaN compound has long been known as a semiconductor with a band gap of approximately 1 eV, but its electronic properties remain largely unexplored. By using density functional theory, we find that the band gap of ThTaN is very sensitive to the hydrostatic pressure/strain. A Dirac cone can emerge around the Γ point with an ultrahigh Fermi velocity at a compressive strain of 8%. Interestingly, the effect of spin-orbital coupling (SOC) is significant, leading to a band gap reduction of 0.26 eV in the ThTaN compound. Moreover, the strong SOC can turn ThTaN into a topological insulator with a large inverted gap up to 0.25 eV, which can be primarily attributed to the inversion between the d-orbital of the heavy element Ta and the p-orbital of N. Our results highlight a new 3D topological insulator with strain-mediated topological transition for potential applications in future spintronics.

摘要

立方相ThTaN化合物长期以来被认为是一种带隙约为1 eV的半导体,但其电子性质在很大程度上仍未得到探索。通过使用密度泛函理论,我们发现ThTaN的带隙对静水压力/应变非常敏感。在8%的压缩应变下,狄拉克锥可以在Γ点附近出现,具有超高的费米速度。有趣的是,自旋轨道耦合(SOC)的影响显著,导致ThTaN化合物的带隙减小了0.26 eV。此外,强SOC可以使ThTaN变成一种拓扑绝缘体,其大的反转带隙高达0.25 eV,这主要归因于重元素Ta的d轨道和N的p轨道之间的反转。我们的结果突出了一种新的三维拓扑绝缘体,具有应变介导的拓扑转变,有望在未来的自旋电子学中得到应用。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/d2a7c64c6c19/Beilstein_J_Nanotechnol-09-1399-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/ef7df165f482/Beilstein_J_Nanotechnol-09-1399-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/9bed57dc66c2/Beilstein_J_Nanotechnol-09-1399-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/4967fd5d67a0/Beilstein_J_Nanotechnol-09-1399-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/bb75d96e615e/Beilstein_J_Nanotechnol-09-1399-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/d2a7c64c6c19/Beilstein_J_Nanotechnol-09-1399-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/ef7df165f482/Beilstein_J_Nanotechnol-09-1399-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/9bed57dc66c2/Beilstein_J_Nanotechnol-09-1399-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/4967fd5d67a0/Beilstein_J_Nanotechnol-09-1399-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/bb75d96e615e/Beilstein_J_Nanotechnol-09-1399-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/a43c/6009352/d2a7c64c6c19/Beilstein_J_Nanotechnol-09-1399-g006.jpg

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