Cowan M M, Taylor K G, Doyle R J
J Bacteriol. 1987 Jul;169(7):2995-3000. doi: 10.1128/jb.169.7.2995-3000.1987.
The initial adhesion of Streptococcus sanguis 10556 to artificial salivary pellicle and to bare hydroxylapatite was studied at several temperatures between 18 and 37 degrees C. When the natural logarithms of rate constants for adsorption and desorption were plotted against reciprocal temperatures in Arrhenius plots, curved lines were obtained, indicating that the thermodynamic quantities of enthalpy and entropy of activation were temperature dependent. For the bare hydroxylapatite system, the heat capacity (delta Cp = dH/dT) was large and negative. delta Cp was also negative for adhesion to saliva-coated hydroxylapatite, although its value was lower. Negative heat capacities, when coupled with favorable entropy, are often indicative of either electrostatic or hydrophobic interactions. When electrolyte (100 mM ammonium sulfate) was added to the cell-hydroxylapatite bead mixture, the rate and extent of adhesion were decreased. Addition of nonpolar p-dioxane (10% [vol/vol], final concentration) to the mixture enhanced binding. This suggests that electrostatic linkages participate in the primary adhesion of streptococci to both substrata. The strongly positive entropy values and the lesser temperature dependence of the saliva-coated hydroxylapatite system suggest that another entropy-driven process is imposed on the electrostatic linkages. This supports a role for hydrophobicity, suggesting that a combination of electrostatic and hydrophobic forces mediate the initial adhesion of S. sanguis to the salivary pellicle.
研究了血链球菌10556在18至37摄氏度之间的几个温度下对人工唾液薄膜和裸露羟基磷灰石的初始黏附情况。当将吸附和解吸速率常数的自然对数与阿累尼乌斯图中的倒数温度作图时,得到了曲线,表明活化焓和活化熵的热力学量与温度有关。对于裸露的羟基磷灰石系统,热容(ΔCp = dH/dT)很大且为负值。对于黏附到唾液包被的羟基磷灰石上,ΔCp也为负值,尽管其值较低。负热容与有利的熵相结合时,通常表明存在静电或疏水相互作用。当向细胞 - 羟基磷灰石珠混合物中加入电解质(100 mM硫酸铵)时,黏附的速率和程度降低。向混合物中加入非极性的对二氧六环(10% [体积/体积],终浓度)可增强结合。这表明静电连接参与了链球菌对两种底物的初始黏附。唾液包被的羟基磷灰石系统的强正熵值和较小的温度依赖性表明,另一个熵驱动过程作用于静电连接。这支持了疏水性的作用,表明静电和疏水作用力的组合介导了血链球菌对唾液薄膜的初始黏附。