Department of Mechanical Engineering , The University of Texas at Dallas , 800 W. Campbell Rd. , Richardson , Texas 75080 , United States.
ACS Appl Mater Interfaces. 2019 Jan 30;11(4):4364-4372. doi: 10.1021/acsami.8b18730. Epub 2019 Jan 18.
Infiltration of a molten metal phase into a ceramic scaffold to manufacture metal-ceramic composites often involves high temperature, high pressure, and expensive processes. Low-cost processes for fabrication of metal-ceramic composites can substantially increase their applications in various industries. In this article, electroplating (electrodeposition) as a low-cost, room-temperature process is demonstrated for infiltration of metal (copper) into a lamellar ceramic (alumina) scaffold. Estimation shows that this is a low energy consumption process. Characterization of mechanical properties showed that metal infiltration enhanced the flexural modulus and strength by more than 50% and 140%, respectively, compared to the pure lamellar ceramic. More importantly, metal infiltration remarkably enhanced the crack initiation and crack growth resistance by more than 230% and 510% compared to the lamellar ceramic. The electrodeposition process for development of metal-ceramic composites can be extended to other metals and alloys that can be electrochemically deposited, as a low-cost and versatile process.
熔融金属相渗透到陶瓷支架中制造金属陶瓷复合材料通常需要高温、高压和昂贵的工艺。制造金属陶瓷复合材料的低成本工艺可以大大增加它们在各个行业的应用。本文展示了一种低成本、室温工艺,即电镀(电沉积),用于将金属(铜)渗透到层状陶瓷(氧化铝)支架中。估算表明,这是一个低能耗的过程。机械性能的表征表明,与纯层状陶瓷相比,金属渗透使弯曲模量和强度分别提高了 50%以上和 140%以上。更重要的是,与层状陶瓷相比,金属渗透使裂纹起始和裂纹扩展阻力分别提高了 230%以上和 510%以上。用于开发金属陶瓷复合材料的电沉积工艺可以扩展到其他可以通过电化学沉积的金属和合金,作为一种低成本和通用的工艺。