School of Electronics Engineering, Kyungpook National University, Daegu 41566, Korea.
Center for Integrated Smart Sensors, KAIST, Daejeon 34141, Korea.
Sensors (Basel). 2019 Jan 24;19(3):472. doi: 10.3390/s19030472.
A complementary metal oxide semiconductor (CMOS) image sensor (CIS), using offset pixel aperture (OPA) technique, was designed and fabricated using the 0.11-µm CIS process. In conventional cameras, an aperture is located on the camera lens. However, in a CIS camera using OPA technique, apertures are integrated as left-offset pixel apertures (LOPAs) and right-offset pixel apertures (ROPAs). A color pattern is built, comprising LOPA, blue, red, green, and ROPA pixels. The disparity information can be acquired from the LOPA and ROPA channels. Both disparity information and two-dimensional (2D) color information can be simultaneously acquired from the LOPA, blue, red, green, and ROPA channels. A geometric model of the OPA technique is constructed to estimate the disparity of the image, and the measurement results are compared with the estimated results. Depth extraction is thus achieved by a single CIS using the OPA technique, which can be easily adapted to commercial CIS cameras.
互补金属氧化物半导体（CMOS）图像传感器（CIS）采用偏移像素孔径（OPA）技术，使用 0.11-µm CIS 工艺进行设计和制造。在传统相机中，孔径位于相机镜头上。然而，在使用 OPA 技术的 CIS 相机中，孔径被集成作为左偏移像素孔径（LOPA）和右偏移像素孔径（ROPA）。构建了一个包含 LOPA、蓝色、红色、绿色和 ROPA 像素的彩色图案。视差信息可以从 LOPA 和 ROPA 通道获取。可以从 LOPA、蓝色、红色、绿色和 ROPA 通道同时获取视差信息和二维（2D）彩色信息。构建了 OPA 技术的几何模型来估计图像的视差，并且将测量结果与估计结果进行了比较。通过使用 OPA 技术的单个 CIS 可以实现深度提取，这可以很容易地适应商业 CIS 相机。
