Kim Yeonju, Tentzeris Manos M, Lim Sungjoon
School of Electrical and Electronics Engineering, College of Engineering, Chung-Ang University, Seoul 06974, Korea.
School of Electrical and Computer Engineering, College of Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA.
Materials (Basel). 2019 Jan 28;12(3):402. doi: 10.3390/ma12030402.
This article proposes a low-loss and light 3D-printed substrate-integrated waveguide (SIW). Despite the use of lossy polylactic acid (PLA) material, insertion loss is reduced, and bandwidth is increased due to a honeycomb substrate similar to air. To demonstrate the proposed concept, we fabricated microstrip-fed SIWs with solid PLA and honeycomb substrates, and compared their performance numerically and experimentally. Average measured insertion loss from 3.4 to 5.5 GHz for the honeycomb SIW is 1.38 dB, whereas SIW with solid PLA is 3.15 dB. Light weight is an additional advantage of the proposed structure.
本文提出了一种低损耗且轻质的三维打印基片集成波导（SIW）。尽管使用了有损耗的聚乳酸（PLA）材料，但由于类似空气的蜂窝状基板，插入损耗得以降低，带宽得以增加。为了验证所提出的概念，我们制作了带有实心PLA和蜂窝状基板的微带馈电SIW，并对其性能进行了数值和实验比较。蜂窝状SIW在3.4至5.5 GHz频段的平均实测插入损耗为1.38 dB，而实心PLA的SIW为3.15 dB。轻质是所提出结构的另一个优点。
