Department of Materials Science and Engineering, Research Institute of Advanced Materials , Seoul National University , Seoul 08826 , Republic of Korea.
School of Chemical Engineering and Materials Science , Chung-Ang University , Seoul 06974 , Republic of Korea.
ACS Appl Mater Interfaces. 2019 Feb 27;11(8):8155-8163. doi: 10.1021/acsami.8b15769. Epub 2019 Feb 13.
Recently, organometallic and all-inorganic halide perovskites (HPs) have become promising materials for resistive switching (RS) nonvolatile memory devices with low power consumption because they show current-voltage hysteresis caused by fast ion migration. However, the toxicity and environmental pollution potential of lead, a common constituent of HPs, has limited the commercial applications of HP-based devices. Here, RS memory devices based on lead-free all-inorganic cesium tin iodide (CsSnI) perovskites with temperature tolerance are successfully fabricated. The devices exhibit reproducible and reliable bipolar RS characteristics in both Ag and Au top electrodes (TEs) with different switching mechanisms. The Ag TE devices show filamentary RS behavior with ultralow operating voltages (<0.15 V). In contrast, the Au TE devices have interface-type RS behavior with gradual resistance changes. This suggests that the RS characteristics are attributed to either the formation of metal filaments or the ion migration of defects in HPs under applied electric fields. These distinct mechanisms may permit the opportunity to design devices for specific purposes. This work will pave the way for lead-free all-inorganic HP-based nonvolatile memory for commercial application in HP-based devices.
最近,由于金属有机和全无机卤化物钙钛矿(HP)显示出由快速离子迁移引起的电流-电压滞后,因此它们成为具有低功耗的电阻式开关(RS)非易失性存储器件的有前途的材料。然而,作为 HP 的常见成分的铅的毒性和环境污染潜力限制了基于 HP 的器件的商业应用。在这里,成功制造了具有耐温性的基于无铅全无机铯锡碘化物(CsSnI)钙钛矿的 RS 存储器器件。该器件在具有不同开关机制的 Ag 和 Au 顶电极(TE)中表现出可重复且可靠的双极 RS 特性。Ag TE 器件显示具有超低工作电压(<0.15 V)的丝状 RS 行为。相比之下,Au TE 器件具有渐变电阻变化的界面型 RS 行为。这表明 RS 特性归因于在施加电场下 HP 中的金属丝的形成或缺陷的离子迁移。这些不同的机制可能为设计针对特定用途的器件提供机会。这项工作将为基于无铅全无机 HP 的非易失性存储器铺平道路,以实现基于 HP 的器件的商业应用。