Ti/Al固态界面金属间化合物的生长特性
Growth Characterization of Intermetallic Compound at the Ti/Al Solid State Interface.
作者信息
Zhao Yangyang, Li Jiuyong, Qiu Ranfeng, Shi Hongxin
机构信息
School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471039, China.
Henan Key Laboratory of Advanced Non-ferrous Metals, Luoyang 471003, China.
出版信息
Materials (Basel). 2019 Feb 4;12(3):472. doi: 10.3390/ma12030472.
Ti-Al diffusion couples, prepared by resistance spot welding, were annealed up to 112 hours at 823, 848, and 873 K in ambient atmosphere. The interfacial microstructure was observed and analyzed using SEM and TEM. The growth characterization of intermetallic compound formed at the Ti/Al solid state interface was investigated. Only TiAl₃ phase was detected in the interfacial zone, and its growth was governed by reaction-controlled mechanism in the previous period and by diffusion-controlled mechanism in the latter period. The activation energies were 198019 and 122770 J/mol for reaction-controlled and diffusion-controlled mechanism, respectively.
通过电阻点焊制备的Ti-Al扩散偶在环境气氛中于823、848和873 K下退火长达112小时。使用扫描电子显微镜（SEM）和透射电子显微镜（TEM）观察和分析界面微观结构。研究了在Ti/Al固态界面形成的金属间化合物的生长特性。在界面区域仅检测到TiAl₃相，其生长前期受反应控制机制支配，后期受扩散控制机制支配。反应控制机制和扩散控制机制的活化能分别为198019和122770 J/mol。
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