Vatnalmath Manjunath, Auradi Virupaxi, J Varun Kumar M, Murthy Bharath Vedashantha, Nagaral Madeva, Pandian A Anbarasa, Islam Saiful, Khan Mohammad Shahiq, Anjinappa Chandrashekar, Razak Abdul
Department of Mechanical Engineering, Siddaganga Institute of Technology, Visvesvaraya Technological University, Tumakuru, Karnataka 572103, India.
Department of Mechanical Engineering, RNS Institute of Technology, Visvesvaraya Technological University, Bangalore, Karnataka 560098, India.
ACS Omega. 2023 Jul 17;8(29):26332-26339. doi: 10.1021/acsomega.3c02838. eCollection 2023 Jul 25.
The present study aims at producing transient liquid phase (TLP) bonded Al2219 joints with pure Cu (copper) as an interlayer. The TLP bonding is carried out at the bonding temperatures in the range of 480 to 520 °C while keeping the bonding pressure (2 MPa) and time (30 min.) constant. Reaction layers are formed at the Al-Cu interface with a significant increase in diffusion depth with the increase in the bonding temperature. The microstructural investigations are carried out using scanning electron microscopy and energy-dispersive spectroscopy. X-ray diffraction study confirms the formation of CuAl, CuAl, and CuAl intermetallic compounds across the interface of the bonded specimens. An increase in microhardness is observed across the bonding zone with the increase in the bonding temperature, and a maximum hardness value of 723 Hv is obtained on the diffusion zone of the specimen bonded at 520 °C. Furthermore, the fractography study of the bonded specimens is carried out, and a maximum shear strength of 18.75 MPa is observed on the joints produced at 520 °C.
本研究旨在制备以纯铜（Cu）为中间层的瞬时液相（TLP）连接Al2219接头。TLP连接在480至520°C的连接温度下进行，同时保持连接压力（2 MPa）和时间（30分钟）恒定。在Al-Cu界面处形成反应层，随着连接温度的升高，扩散深度显著增加。使用扫描电子显微镜和能量色散光谱进行微观结构研究。X射线衍射研究证实，在连接试样的界面上形成了CuAl、CuAl和CuAl金属间化合物。随着连接温度的升高，在连接区域观察到显微硬度增加，在520°C连接的试样的扩散区域获得了723 Hv的最大硬度值。此外，对连接试样进行了断口分析，在520°C制备的接头上观察到最大剪切强度为18.75 MPa。
