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UiO-66 骨架中的卤键促进了优越的化学战剂模拟物的降解。

Halogen bonding in UiO-66 frameworks promotes superior chemical warfare agent simulant degradation.

机构信息

Department of Chemistry and Biochemistry, University of California, San Diego, La Jolla, CA 92023-0358, USA.

出版信息

Chem Commun (Camb). 2019 Mar 19;55(24):3481-3484. doi: 10.1039/c9cc00642g.

Abstract

Herein, a series of halogenated UiO-66 derivatives was synthesized and analyzed for the breakdown of the chemical warfare agent simulant dimethyl-4-nitrophenyl phosphate (DMNP) to analyze ligand effects. UiO-66-I degrades DMNP at a rate four times faster than the most active previously reported MOFs. MOF defects were quantified and ruled out as a cause for increased activity. Theoretical calculations suggest the enhanced activity of UiO-66-I originates from halogen bonding of the iodine atom to the phosphoester linkage allowing for more rapid hydrolysis of the P-O bond.

摘要

在此,我们合成了一系列卤化的 UiO-66 衍生物,并对其进行了分析,以研究配体效应对化学战剂模拟物二甲基-4-硝基苯膦酸酯(DMNP)分解的影响。UiO-66-I 使 DMNP 的降解速度比之前报道的最活跃的 MOFs 快四倍。MOF 缺陷被量化,并被排除为提高活性的原因。理论计算表明,UiO-66-I 的增强活性源于碘原子与磷酸酯键的卤键相互作用,从而允许更快地水解 P-O 键。

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