Tian Shenghui, Luo Yuanfang, Chen Jizun, He Hui, Chen Yong, Ling Zhang
Chongqing Key Laboratory of Nano-Micro Composite Materials and Devices, School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China.
School of Materials Science and Engineering, Key Lab of Guangdong Province for High Property and Functional Macromolecular Materials, South China University of Technology, Guangzhou 510640, China.
Materials (Basel). 2019 Mar 15;12(6):876. doi: 10.3390/ma12060876.
In this study, non-metallic materials of waste-printed circuit board powders (WPCBP) were successfully used as reinforcing filler to produce polypropylene (PP)⁻wood composites, and their effect on the weathering properties of PP composites were fully evaluated via oxidation induction time (OIT), attenuated total reflectance Fourier-transform infrared spectroscopy (ATR-FTIR), differential scanning calorimetry, vicat softening point (VST), scanning electron microscopy, and mechanical properties analysis. The OIT analysis confirmed that the anti-thermal oxidative aging properties of PP⁻wood composites were decreased with the loading of WPCBP. Apart from that, the PP composite, reinforced with 30 wt.% of WPCBP, exhibited the highest value of active energy, which suggests that it is more sensitive to temperature and oxygen when compared with other PP composites. The mechanical properties analysis revealed that neat PP exhibited the poorest weathering properties after being subjected to UV exposure, and its retention rate of tensile strength and notched impact strength were only 70.6% and 59.6%, respectively, while WPCBP and wood flour (WF) could efficiently improve the retention rates of the mechanical properties of the PP composites when subjected to UV exposure. The visual appearance of the PP composites after being subjected to UV exposure showed more and smaller cracks with the loading of WPCBP and WF. The ATR-FTIR results revealed that the carbonyl index increased for all the weathered samples, and the more WPCBP was added into the PP composites led to a higher carbonyl index value, which might be due to the multivalent transition metals in WPCBP, which accelerate the photo-oxidation of the PP composites. The VST results show that both WPCBP and WF can effectively enhance the heat deformation resistance of the PP composites that have been subjected to UV exposure.
在本研究中,废弃印刷电路板粉末(WPCBP)中的非金属材料成功用作增强填料来制备聚丙烯(PP)-木材复合材料,并通过氧化诱导时间(OIT)、衰减全反射傅里叶变换红外光谱(ATR-FTIR)、差示扫描量热法、维卡软化点(VST)、扫描电子显微镜和力学性能分析,全面评估了它们对PP复合材料耐候性能的影响。OIT分析证实,PP-木材复合材料的抗热氧化老化性能随WPCBP的添加量而降低。除此之外,添加30 wt.% WPCBP的PP复合材料表现出最高的活化能值,这表明与其他PP复合材料相比,它对温度和氧气更敏感。力学性能分析表明,纯PP在紫外线照射后耐候性能最差,其拉伸强度和缺口冲击强度的保留率分别仅为70.6%和59.6%,而WPCBP和木粉(WF)可以有效提高PP复合材料在紫外线照射后的力学性能保留率。PP复合材料在紫外线照射后的外观显示,随着WPCBP和WF的添加,裂纹更多且更小。ATR-FTIR结果表明,所有老化样品的羰基指数均增加,并且PP复合材料中添加的WPCBP越多,羰基指数值越高,这可能是由于WPCBP中的多价过渡金属加速了PP复合材料的光氧化。VST结果表明,WPCBP和WF都能有效提高已受紫外线照射的PP复合材料的耐热变形性。