Patton Steven T, Chen Chenggang, Hu Jianjun, Grazulis Lawrence, Schrand Amanda M, Roy Ajit K
Nonstructural Materials Division, University of Dayton Research Institute, Dayton, OH 45469-0050, USA.
Munitions Directorate, Air Force Research Laboratory, Eglin Air Force Base, Valparaiso, FL 45433-7750, USA.
Polymers (Basel). 2016 Dec 29;9(1):6. doi: 10.3390/polym9010006.
Electromechanical, adhesion, and viscoelastic properties of polymers and polymer nanocomposites (PNCs) are of interest for additive manufacturing (AM) and flexible electronics. Development/optimization of inks for AM is complex, expensive, and substrate/interface dependent. This study investigates properties of free standing films of a thermoplastic polyurethane (TPU) polymer and an Ag⁻carbon black (Ag-CB) TPU PNC in a lightly loaded low strain compression contact as a rough measure of their suitability for AM. The TPU exhibited high hysteresis and a large viscoelastic response, and sufficient dwell time was needed for polymer chain relaxation and measurable adhesion. A new discovery is that large enough contact area is needed to allow longer time constant polymer ordering in the contact that led to higher adhesion and better performance/reliability. This has previously unknown implications for interface size relative to polymer chain length in AM design. The standard linear model was found to be a good fit for the viscoelastic behavior of the TPU. The PNC exhibited no adhesion (new result), low electrical resistance, and relatively small viscoelastic response. This implies potential for AM electrical trace as well as switch applications.
聚合物及聚合物纳米复合材料(PNC)的机电、粘附和粘弹性特性对于增材制造(AM)和柔性电子学而言具有重要意义。用于增材制造的墨水的开发/优化过程复杂、成本高昂且依赖于基材/界面。本研究调查了热塑性聚氨酯(TPU)聚合物和银-炭黑(Ag-CB)TPU PNC的自支撑薄膜在轻载低应变压缩接触中的特性,以此作为它们适用于增材制造的粗略衡量标准。TPU表现出高滞后性和大粘弹性响应,聚合物链松弛和可测量的粘附需要足够的停留时间。一个新发现是,需要足够大的接触面积,以便在接触中实现更长时间常数的聚合物有序排列,从而导致更高的粘附力和更好的性能/可靠性。这对于增材制造设计中相对于聚合物链长度的界面尺寸具有此前未知的影响。发现标准线性模型非常适合TPU的粘弹性行为。PNC表现出无粘附性(新结果)、低电阻和相对较小的粘弹性响应。这意味着其在增材制造电气线路以及开关应用方面具有潜力。