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使用铒铬钇钪石榴石激光去除正畸托槽再粘接时牙釉质表面的残留粘结剂。

Use of the Er,Cr:YSGG laser for removing remnant adhesive from the enamel surface in rebonding of orthodontic brackets.

机构信息

Orthodontics and Dentofacial Orthopedics, Field of Oral and Maxillofacial Growth and Development, Course of Clinical Science, The Nippon Dental University Graduate School of Life Dentistry at Niigata, 1-8 Hamaura-cho, Chuo-ku, Niigata, 951-8580, Japan.

Department of Pediatric Dentistry, The Nippon Dental University School of Life Dentistry at Niigata, 1-8 Hamaura-cho, Chuo-ku, Niigata, 951-8580, Japan.

出版信息

Odontology. 2020 Apr;108(2):271-279. doi: 10.1007/s10266-019-00448-0. Epub 2019 Aug 26.

Abstract

The aim of this study was to compare the use of the Er,Cr:YSGG laser with the use of adhesive-removing pliers for removing remnant adhesive from the enamel surface. A total of 54 sound premolars were divided into two groups of 27. Each group was assigned one of two adhesive removal systems: the Er,Cr:YSGG laser, and adhesive-removing pliers. Shear bond strength was measured 24 h after bracket bonding, with the bracket bonding/debonding and residual adhesive removal procedures repeated twice after the first adhesive removal. Before the first bonding and after each adhesive removal procedure, the average surface roughness (Ra) of each tooth was measured. Additionally, 14 of the premolars were examined under a scanning electron microscope. There were no significant differences in the shear bond strength between the two removal systems or between the three debonding sequences. There were significant differences in the enamel surface roughness after each removal sequence between the adhesive removal systems, and a significant increase in the enamel surface roughness was noted in each group with successive removal sequences. The scanning electron microscope images revealed evaporation of the primer and adhesive on the enamel surface and laser etching of enamel in the laser removal group, and the remnants of primer and adhesive on the enamel surface after each removal sequence in the plier removal group. The Er,Cr:YSGG laser was useful for removing remnant adhesive from the enamel surface for bracket rebonding.

摘要

本研究旨在比较 Er,Cr:YSGG 激光与去胶钳用于去除牙釉质表面残余粘结剂的效果。将 54 颗健康的前磨牙分为两组,每组 27 颗。每组采用两种去胶系统之一:Er,Cr:YSGG 激光和去胶钳。在托槽粘结后 24 小时测量剪切粘结强度,第一次去胶后重复两次托槽粘结/去胶和残余粘结剂去除程序。在第一次粘结和每次去胶程序后,测量每颗牙的平均表面粗糙度(Ra)。此外,14 颗前磨牙在扫描电子显微镜下进行检查。两种去胶系统之间或三次去胶序列之间的剪切粘结强度无显著差异。两种去胶系统之间的牙釉质表面粗糙度在每次去胶后均有显著差异,每个组的牙釉质表面粗糙度随着连续的去胶序列而显著增加。扫描电子显微镜图像显示,激光去胶组的粘结剂和底漆在牙釉质表面蒸发,激光去胶组的牙釉质表面有激光蚀刻,去胶钳去胶组在每次去胶后仍有底漆和粘结剂的残余。Er,Cr:YSGG 激光可用于去除托槽重新粘结时牙釉质表面的残余粘结剂。

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