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通过自组装分子单层实现无缺陷掺杂:磷掺杂硅中间隙碳相关缺陷的演变

Toward Defect-Free Doping by Self-Assembled Molecular Monolayers: The Evolution of Interstitial Carbon-Related Defects in Phosphorus-Doped Silicon.

作者信息

Gao Xuejiao, Guan Bin, Mesli Abdelmadjid, Chen Kaixiang, Sun Limin, Dan Yaping

机构信息

University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, Shanghai 200240, China.

Institut Matériaux Microélectronique Nanosciences de Provence, UMR 6242 CNRS, Université Aix-Marseille, Marseille Cedex 20 13397, France.

出版信息

ACS Omega. 2019 Feb 18;4(2):3539-3545. doi: 10.1021/acsomega.8b03372. eCollection 2019 Feb 28.

Abstract

Self-assembled molecular monolayer (SAMM) doping on semiconductors has been widely appraised for its advantages of doping nanoelectronic devices for applications in the complementary metal-oxide-semiconductor transistor (CMOS) industry. However, defects introduced by SAMM-doping will limit the performance of the devices. Previously, we have found that SAMM-doping can bring carbon impurities into the silicon substrate and these unwanted carbon impurities can deactivate phosphorus dopants by forming an interstitial carbon (C)-substitutional phosphorus (C-P) complex. Herein, to develop a defect-free SAMM-doping process, the generation and annihilation of C-related defects are investigated by extending the thermal annealing time from 2 to 10 min using secondary ion mass spectrometry and deep-level transient spectroscopy. The results show that the concentration of C-related carbon defects is lower after a longer time of thermal annealing, although a longer annealing time actually introduces a higher concentration of carbon impurities into Si. This observation indicates that interstitial carbon evolves into substitutional carbon (C) that is electrically inactive during the thermal annealing process. A defect-free SAMM-doping process may be developed by an appropriate post-annealing process.

摘要

自组装分子单层(SAMM)掺杂半导体因其在互补金属氧化物半导体晶体管(CMOS)行业中用于掺杂纳米电子器件的优势而受到广泛评价。然而,SAMM掺杂引入的缺陷会限制器件的性能。此前,我们发现SAMM掺杂会将碳杂质带入硅衬底,这些不需要的碳杂质会通过形成间隙碳(C)-替代磷(C-P)络合物使磷掺杂剂失活。在此,为了开发无缺陷的SAMM掺杂工艺,使用二次离子质谱和深能级瞬态光谱将热退火时间从2分钟延长至10分钟,研究了与C相关的缺陷的产生和消除。结果表明,尽管较长的退火时间实际上会将更高浓度的碳杂质引入硅中,但在较长时间的热退火后,与C相关的碳缺陷浓度较低。这一观察结果表明,间隙碳在热退火过程中演变成电活性较低的替代碳(C)。通过适当的后退火工艺可能开发出无缺陷的SAMM掺杂工艺。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/faef/6648394/3f972a9fe29e/ao-2018-03372v_0001.jpg

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