Private Practice of Orthodontics, 2907 Fairfield Ln., Midland, TX 79705, USA.
LSU Health Sciences Center, Department of Orthodontics, 1100 Florida Avenue, New Orleans, LA 70119, USA.
Int Orthod. 2020 Mar;18(1):115-120. doi: 10.1016/j.ortho.2019.07.005. Epub 2019 Aug 27.
The aim of this study was to determine if there are differences between the shear bond strengths of 3 types of ceramic brackets when bonded to different ceramic substrates using an aluminium oxide air abrasion etchant protocol.
Substrate groups consisting of thirty-six lithium disilicate (e.max® CAD) samples and thirty-six lithium silicate infused with zirconia (CELTRA® DUO) samples were fabricated to replicate the facial surface of a left maxillary central incisor. The surface of all samples was prepared with an aluminium oxide air abrasion etchant protocol. Each substrate group was split into three test groups (n=12). Each test group was bonded using a different brand of ceramic orthodontic bracket. Shear bond strength (SBS) testing was conducted and the mean SBS values for each group were calculated and recorded in MPa. An Adhesive Resin Index (ARI) score was also assigned to each sample to assess the location of bond failure.
Mean SBS of the e.max® CAD groups were significantly less than the CELTRA® DUO groups. Symetri brackets showed significantly higher shear bond strengths to both substrates than both of the other brackets tested. ARI scores of the e.max® CAD groups were significantly less than the CELTRA® DUO groups.
The Symetri bracket was the only bracket that was effective for both substrates (mean SBS>6mPa). The Etch Master protocol does not appear effective for e.max® CAD.
本研究旨在确定使用氧化铝喷砂蚀刻剂方案将 3 种陶瓷托槽粘结到不同陶瓷基底时,其剪切粘结强度是否存在差异。
制作了 36 个锂硅二酸盐(e.max® CAD)样本和 36 个含氧化锆锂硅(CELTRA® DUO)样本的基底组,以复制左上中切牙的唇面。所有样本的表面均采用氧化铝喷砂蚀刻剂方案进行处理。将每个基底组分为 3 个测试组(n=12)。每个测试组使用不同品牌的陶瓷正畸托槽进行粘结。进行剪切粘结强度(SBS)测试,并计算和记录每个组的平均 SBS 值,单位为兆帕。还对每个样本分配了一个黏附树脂指数(ARI)评分,以评估粘结失败的位置。
e.max® CAD 组的平均 SBS 值明显小于 CELTRA® DUO 组。Symetri 托槽对两种基底的剪切粘结强度明显高于其他两种测试的托槽。e.max® CAD 组的 ARI 评分明显小于 CELTRA® DUO 组。
Symetri 托槽是唯一对两种基底均有效的托槽(平均 SBS>6mPa)。Etch Master 方案似乎对 e.max® CAD 无效。