Dai Wen, Ren Xing-Jie, Yan Qingwei, Wang Shengding, Yang Mingyang, Lv Le, Ying Junfeng, Chen Lu, Tao Peidi, Sun Liwen, Xue Chen, Yu Jinhong, Song Chengyi, Nishimura Kazuhito, Jiang Nan, Lin Cheng-Te
Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, People's Republic of China.
Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, People's Republic of China.
Nanomicro Lett. 2022 Dec 9;15(1):9. doi: 10.1007/s40820-022-00979-2.
Developing advanced thermal interface materials (TIMs) to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor devices. Based on the ultra-high basal-plane thermal conductivity, graphene is an ideal candidate for preparing high-performance TIMs, preferably to form a vertically aligned structure so that the basal-plane of graphene is consistent with the heat transfer direction of TIM. However, the actual interfacial heat transfer efficiency of currently reported vertically aligned graphene TIMs is far from satisfactory. In addition to the fact that the thermal conductivity of the vertically aligned TIMs can be further improved, another critical factor is the limited actual contact area leading to relatively high contact thermal resistance (20-30 K mm W) of the "solid-solid" mating interface formed by the vertical graphene and the rough chip/heat sink. To solve this common problem faced by vertically aligned graphene, in this work, we combined mechanical orientation and surface modification strategy to construct a three-tiered TIM composed of mainly vertically aligned graphene in the middle and micrometer-thick liquid metal as a cap layer on upper and lower surfaces. Based on rational graphene orientation regulation in the middle tier, the resultant graphene-based TIM exhibited an ultra-high thermal conductivity of 176 W m K. Additionally, we demonstrated that the liquid metal cap layer in contact with the chip/heat sink forms a "liquid-solid" mating interface, significantly increasing the effective heat transfer area and giving a low contact thermal conductivity of 4-6 K mm W under packaging conditions. This finding provides valuable guidance for the design of high-performance TIMs based on two-dimensional materials and improves the possibility of their practical application in electronic thermal management.
开发先进的热界面材料（TIMs）以连接发热芯片和散热器，构建高效的热传递界面，是解决高功率半导体器件热管理问题的关键技术。基于超高的基面热导率，石墨烯是制备高性能TIMs的理想候选材料，最好形成垂直排列结构，使石墨烯的基面与TIM的热传递方向一致。然而，目前报道的垂直排列石墨烯TIMs的实际界面热传递效率远不能令人满意。除了垂直排列TIMs的热导率可进一步提高外，另一个关键因素是实际接触面积有限，导致垂直石墨烯与粗糙芯片/散热器形成的“固-固”匹配界面的接触热阻相对较高（20-30 K·mm²/W）。为解决垂直排列石墨烯面临的这一普遍问题，在本工作中，我们结合机械取向和表面改性策略，构建了一种三层TIM，中间主要由垂直排列的石墨烯组成，上下表面为微米厚的液态金属作为覆盖层。基于中间层合理的石墨烯取向调控，所得的石墨烯基TIM表现出176 W·m⁻¹·K⁻¹的超高热导率。此外，我们证明与芯片/散热器接触的液态金属覆盖层形成了“液-固”匹配界面，显著增加了有效热传递面积，在封装条件下接触热导率低至4-6 K·mm²/W。这一发现为基于二维材料的高性能TIMs设计提供了有价值的指导，提高了其在电子热管理中实际应用的可能性。
Zotero 插件
