Dai Wen, Lv Le, Lu Jibao, Hou Hao, Yan Qingwei, Alam Fakhr E, Li Yifan, Zeng Xiaoliang, Yu Jinhong, Wei Qiuping, Xu Xiangfan, Wu Jianbo, Jiang Nan, Du Shiyu, Sun Rong, Xu Jianbin, Wong Ching-Ping, Lin Cheng-Te
Center of Materials Science and Optoelectronics Engineering , University of Chinese Academy of Sciences , Beijing 100049 , PR China.
State Key Laboratory of Powder Metallurgy, School of Materials Science and Engineering , Central South University , Changsha 410083 , PR China.
ACS Nano. 2019 Feb 26;13(2):1547-1554. doi: 10.1021/acsnano.8b07337. Epub 2019 Feb 13.
With the increasing integration of devices in electronics fabrication, there are growing demands for thermal interface materials (TIMs) with high through-plane thermal conductivity for efficiently solving thermal management issues. Graphene-based papers consisting of a layer-by-layer stacked architecture have been commercially used as lateral heat spreaders; however, they lack in-depth studies on their TIM applications due to the low through-plane thermal conductivity (<6 W m K). In this study, a graphene hybrid paper (GHP) was fabricated by the intercalation of silicon source and the in situ growth of SiC nanorods between graphene sheets based on the carbothermal reduction reaction. Due to the formation of covalent C-Si bonding at the graphene-SiC interface, the GHP possesses a superior through-plane thermal conductivity of 10.9 W m K and can be up to 17.6 W m K under packaging conditions at 75 psi. Compared with the current graphene-based papers, our GHP has the highest through-plane thermal conductivity value. In the TIM performance test, the cooling efficiency of the GHP achieves significant improvement compared to that of state-of-the-art thermal pads. Our GHP with characteristic structure is of great promise as an inorganic TIM for the highly efficient removal of heat from electronic devices.
随着电子制造中器件集成度的不断提高，对具有高面内热导率的热界面材料（TIMs）的需求日益增长，以有效解决热管理问题。由逐层堆叠结构组成的石墨烯基纸已被商业用作横向热扩散器；然而，由于其面内热导率较低（<6 W m K），对其TIM应用缺乏深入研究。在本研究中，基于碳热还原反应，通过硅源的插层和石墨烯片层间SiC纳米棒的原位生长制备了一种石墨烯混合纸（GHP）。由于在石墨烯-SiC界面形成了共价C-Si键，GHP具有10.9 W m K的优异面内热导率，在75 psi的封装条件下可高达17.6 W m K。与目前的石墨烯基纸相比，我们的GHP具有最高的面内热导率值。在TIM性能测试中，与最先进的热垫相比，GHP的冷却效率有显著提高。我们具有独特结构的GHP作为一种无机TIM，在从电子器件高效散热方面具有巨大潜力。
