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构建具有不同尺寸六方氮化硼的无粘结剂3D热网络以增强聚二甲基硅氧烷复合材料:一项对比研究。

Constructing binder-free 3D thermal networks with hexagonal boron nitride of varying sizes to enhance polydimethylsiloxane composites: a comparative study.

作者信息

Han Liping, Sun Hu, Li Wei, Liu Li, Gan Guoyou, Qian Zhuo, Li Junpeng

机构信息

Sino-Platinum Metals Co., Ltd Kunming 650106 People's Republic of China

Faculty of Material Science and Engineering, Kunming University of Science and Technology Kunming 650093 People's Republic of China

出版信息

RSC Adv. 2025 May 23;15(22):17388-17396. doi: 10.1039/d5ra01204j. eCollection 2025 May 21.

DOI:10.1039/d5ra01204j
PMID:40416631
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC12101106/
Abstract

As electronic devices become more compact and power-dense, the demand for efficient thermal management materials continues to rise. To address the common issues in conventional thermally conductive composites-namely, poor filler dispersion, high interfacial thermal resistance caused by binders, and complex fabrication processes-this study proposes a novel strategy for constructing binder-free three-dimensional hexagonal boron nitride thermal networks (3D BN) within a polydimethylsiloxane (PDMS) matrix. By leveraging the decomposition behavior of ammonium bicarbonate (NHHCO), this approach enables the fabrication of composites with enhanced thermal conductivity and simplified processing. The 3D BN/PDMS composites were prepared a straightforward process involving blending, cold pressing, drying, and vacuum impregnation. Characterization and testing reveal that the 3D BN thermal network and BN particle size are critical factors influencing the composites' TCs. The resulting 3D BN/PDMS composites exhibit an outstanding TC of 3.889 W m K when the BN particle size is 20 μm and the filler content is 40.70 vol%. This study offers a novel approach to designing and developing high-performance thermally conductive composites, with significant potential for practical applications.

摘要

随着电子设备变得越来越紧凑且功率密度越来越高,对高效热管理材料的需求持续增长。为了解决传统导热复合材料中的常见问题,即填料分散性差、由粘合剂导致的高界面热阻以及复杂的制造工艺,本研究提出了一种在聚二甲基硅氧烷(PDMS)基体中构建无粘合剂三维六方氮化硼热网络(3D BN)的新策略。通过利用碳酸氢铵(NH₄HCO₃)的分解行为,这种方法能够制造出具有更高热导率且加工过程简化的复合材料。3D BN/PDMS复合材料通过包括混合、冷压、干燥和真空浸渍在内的简单过程制备而成。表征和测试表明,3D BN热网络和BN粒径是影响复合材料热导率的关键因素。当BN粒径为20μm且填料含量为40.70体积%时,所得的3D BN/PDMS复合材料表现出3.889 W m⁻¹ K⁻¹的出色热导率。本研究为设计和开发高性能导热复合材料提供了一种新方法,具有显著的实际应用潜力。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/73398ce9d8d3/d5ra01204j-f6.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/9a7d43ad0e53/d5ra01204j-f1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/6c1f3c2fb993/d5ra01204j-f2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/38ae68f9572e/d5ra01204j-f3.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/47c48c25482f/d5ra01204j-f4.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/1ead3432518a/d5ra01204j-f5.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/73398ce9d8d3/d5ra01204j-f6.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/9a7d43ad0e53/d5ra01204j-f1.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/6c1f3c2fb993/d5ra01204j-f2.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/38ae68f9572e/d5ra01204j-f3.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/47c48c25482f/d5ra01204j-f4.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/1ead3432518a/d5ra01204j-f5.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1147/12101106/73398ce9d8d3/d5ra01204j-f6.jpg

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