Mi Yan, Gou Jiaxi, Liu Lulu, Ge Xin, Wan Hui, Liu Quan
State Key Laboratory of Power Transmission Equipment & System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China.
Nanomaterials (Basel). 2019 Sep 30;9(10):1396. doi: 10.3390/nano9101396.
Filling epoxy resin (EP) with boron nitride (BN) nanosheets (BNNSs) can effectively improve the thermal conductivity of BN/EP nanocomposites. However, due to the few hydroxyl groups on the surface of BNNSs, silane coupling agent (SCA) cannot effectively modify BNNSs. The agglomeration of BNNSs is severe, which significantly reduces the AC breakdown strength of the composites. Therefore, this paper uses atmospheric pressure bipolar nanosecond pulse dielectric barrier discharge (DBD) Ar+HO low temperature plasma to hydroxylate BNNSs to improve the AC breakdown strength and thermal conductivity of the composites. X-ray photoelectron spectroscopy (XPS) shows that the hydroxyl content of the BNNSs surface increases nearly two fold after plasma modification. Fourier transform infrared spectroscopy (FTIR) and thermogravimetric analysis (TGA) show that plasma modification enhances the dehydration condensation reaction of BNNSs with SCA, and the coating amount of SCA on the BNNSs surface increases by 45%. The breakdown test shows that the AC breakdown strength of the composites after plasma modification is improved under different filling contents. With the filling content of BNNSs increasing from 10% to 20%, the composites can maintain a certain insulation strength. Meanwhile, the thermal conductivity of the composites increases by 67% as the filling content increases from 10% (SCA treated) to 20% (plasma and SCA treated). Therefore, the plasma hydroxylation modification method used in this paper can provide a basis for the preparation of high thermal conductivity insulating materials.
用氮化硼(BN)纳米片(BNNSs)填充环氧树脂(EP)可有效提高BN/EP纳米复合材料的热导率。然而,由于BNNSs表面的羟基较少,硅烷偶联剂(SCA)无法有效地对BNNSs进行改性。BNNSs的团聚严重,这显著降低了复合材料的交流击穿强度。因此,本文采用大气压双极纳秒脉冲介质阻挡放电(DBD)Ar+HO低温等离子体对BNNSs进行羟基化处理,以提高复合材料的交流击穿强度和热导率。X射线光电子能谱(XPS)表明,等离子体改性后BNNSs表面的羟基含量增加了近两倍。傅里叶变换红外光谱(FTIR)和热重分析(TGA)表明,等离子体改性增强了BNNSs与SCA的脱水缩合反应,BNNSs表面SCA的包覆量增加了45%。击穿试验表明,等离子体改性后的复合材料在不同填充量下的交流击穿强度均有所提高。随着BNNSs填充量从10%增加到20%,复合材料能够保持一定的绝缘强度。同时,当填充量从10%(SCA处理)增加到20%(等离子体和SCA处理)时,复合材料的热导率提高了67%。因此,本文采用的等离子体羟基化改性方法可为制备高导热绝缘材料提供依据。