Yang Guoqing, Cui Junda, Ohki Yoshimichi, Wang Deyi, Li Yang, Tao Kai
State Key Laboratory of Eco-hydraulics in Northwest Arid Region of China, Xi'an University of Technology Xi'an 710048 P. R. China
Department of Electrical Engineering and Bioscience, Waseda University Tokyo 169-8555 Japan
RSC Adv. 2018 Aug 31;8(54):30669-30677. doi: 10.1039/c8ra05846f. eCollection 2018 Aug 30.
Hyperbranched polyester is effective for enhancing molecular bond strength and improving the mechanical behavior of nanofilled polymers. This study examines the dielectric and polarization relaxation characteristics of epoxy resin composites filled with nanosilica 30 nm in diameter, which is treated by terminal carboxyl hyperbranched polyester. TEM and SEM analysis indicate that the nanosilica surface is grafted with a functional polymer layer ranging in thickness from several to tens of nanometers, and the nanosilica agglomeration in epoxy resin is remarkably inhibited. Measurements of thermally stimulated depolarization current and differential scanning calorimetry show that, deep traps with an energy of 1.09 eV are present in the nanocomposites, and the glass transition temperature ( ) is increased by 11 °C at most at filler concentrations from 1 to 7 wt%. Moreover, the room-temperature relative permittivity and dielectric loss factor of the composites at 50 Hz are decreased by 0.22 and 1.3‰, respectively. Conductivity at 10 mHz to 1 kHz and dc conductivity are also significantly decreased when the operating temperature is below . The polarization relaxation process of the nanocomposite is dominated by regional carrier migration, interfacial and dipole polarization. The relaxation frequency of dipole polarization at high temperature (> ) is transformed to satisfy the Vogel-Tammann-Fulcher law. This research suggests that both the dielectric and the polarization relaxation properties of the epoxy resin composites can be modified by filling hyperbranched-polyester-treated nanosilica, because it enhances the bond strength of the inorganic-organic interface and enlarges the molecular scale of the composites cross-linking reactions.
超支化聚酯对于增强分子键强度和改善纳米填充聚合物的力学性能是有效的。本研究考察了用端羧基超支化聚酯处理的直径为30nm的纳米二氧化硅填充的环氧树脂复合材料的介电和极化弛豫特性。透射电子显微镜(TEM)和扫描电子显微镜(SEM)分析表明,纳米二氧化硅表面接枝有厚度从几纳米到几十纳米不等的功能聚合物层,并且纳米二氧化硅在环氧树脂中的团聚受到显著抑制。热刺激去极化电流测量和差示扫描量热法表明,纳米复合材料中存在能量为1.09eV的深陷阱,在填料浓度为1wt%至7wt%时,玻璃化转变温度( )最多升高11℃。此外,复合材料在50Hz时的室温相对介电常数和介电损耗因数分别降低了0.22和1.3‰。当工作温度低于 时,10mHz至1kHz的电导率和直流电导率也显著降低。纳米复合材料的极化弛豫过程由区域载流子迁移、界面极化和偶极极化主导。高温(> )下偶极极化的弛豫频率转变以符合Vogel-Tammann-Fulcher定律。本研究表明,通过填充超支化聚酯处理的纳米二氧化硅可以改变环氧树脂复合材料的介电和极化弛豫性能,因为它增强了无机-有机界面的键合强度并扩大了复合材料交联反应的分子尺度。