Wu Yunjian, Zhang Xiaoxing, Negi Ankit, He Jixiong, Hu Guoxiong, Tian Shuangshuang, Liu Jun
School of Electrical Engineering and Automation, Wuhan University, Wuhan 430072, China.
Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC 27695, USA.
Polymers (Basel). 2020 Feb 12;12(2):426. doi: 10.3390/polym12020426.
Polymer composites, with both high thermal conductivity and high electrical insulation strength, are desirable for power equipment and electronic devices, to sustain increasingly high power density and heat flux. However, conventional methods to synthesize polymer composites with high thermal conductivity often degrade their insulation strength, or cause a significant increase in dielectric properties. In this work, we demonstrate epoxy nanocomposites embedded with silver nanoparticles (AgNPs), and modified boron nitride nanosheets (BNNSs), which have high thermal conductivity, high insulation strength, low permittivity, and low dielectric loss. Compared with neat epoxy, the composite with 25 vol% of binary nanofillers has a significant enhancement (10x) in thermal conductivity, which is twice of that filled with BNNSs only (5x), owing to the continuous heat transfer path among BNNSs enabled by AgNPs. An increase in the breakdown voltage is observed, which is attributed to BNNSs-restricted formation of AgNPs conducting channels that result in a lengthening of the breakdown path. Moreover, the effects of nanofillers on dielectric properties, and thermal simulated current of nanocomposites, are discussed.
具有高导热率和高电绝缘强度的聚合物复合材料对于电力设备和电子器件来说是理想的,以承受日益提高的功率密度和热通量。然而,合成具有高导热率的聚合物复合材料的传统方法往往会降低其绝缘强度,或导致介电性能显著增加。在这项工作中,我们展示了嵌入银纳米颗粒(AgNP)和改性氮化硼纳米片(BNNS)的环氧纳米复合材料,它们具有高导热率、高绝缘强度、低介电常数和低介电损耗。与纯环氧树脂相比,含有25体积%二元纳米填料的复合材料的导热率有显著提高(约10倍),这是仅填充BNNS的复合材料(约5倍)的两倍,这归因于AgNP使BNNS之间形成了连续的热传递路径。观察到击穿电压有所增加,这归因于BNNS对AgNP导电通道形成的限制,从而导致击穿路径延长。此外,还讨论了纳米填料对纳米复合材料介电性能和热模拟电流的影响。