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基于 X 射线微 CT 的 PCB 孔加工精度检测。

Machining accuracy detection of PCB hole by X-ray micro-CT.

机构信息

Guangdong University of Technology, China.

Guangdong University of Technology, China.

出版信息

Micron. 2020 Apr;131:102826. doi: 10.1016/j.micron.2020.102826. Epub 2020 Jan 13.

Abstract

Over the past few years, non-destructive testing plays an increasingly important role in the accuracy detection of PCB manufacturing. Due to the complexity of PCB materials and the development of PCB towards high density. So far, no method has been described which can semi-automatically detect the machining accuracy of PCB array holes based on three-dimensional structural data. Here, we propose an efficient method to detect the machining accuracy of PCB array holes by X-ray micro-CT. Firstly, the overall three-dimensional structural data of the sample was obtained by CT scanning and three-dimensional reconstruction. And then all the information of array holes could be extracted and visual analyzed. Finally, the measured values of PCB machining accuracy were gained according to the designed algorithms, such as straightness error, process capability index, cylindricity error and three-dimensional surface roughness. The method that based on X-ray micro-CT can get the results of PCB array holes' machining accuracy precisely and efficiently. The same principle also provides a direction for promoting the development of micro-CT in PCB industry.

摘要

在过去的几年中,无损检测在 PCB 制造的精度检测中发挥着越来越重要的作用。由于 PCB 材料的复杂性以及 PCB 向高密度方向的发展,到目前为止,还没有描述过一种可以基于三维结构数据半自动检测 PCB 阵列孔加工精度的方法。在这里,我们提出了一种利用 X 射线微 CT 检测 PCB 阵列孔加工精度的有效方法。首先,通过 CT 扫描和三维重建获得样品的整体三维结构数据,然后提取和可视化分析所有的阵列孔信息。最后,根据设计的算法,如直线度误差、过程能力指数、圆柱度误差和三维表面粗糙度,获得 PCB 加工精度的测量值。基于 X 射线微 CT 的方法可以精确高效地获得 PCB 阵列孔加工精度的结果。同样的原理也为推动微 CT 在 PCB 行业的发展提供了一个方向。

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