University of Nebraska - Lincoln, Mechanical and Materials Engineering Department, Lincoln, Nebraska, 68588-0526, USA.
Sci Rep. 2020 Feb 12;10(1):2437. doi: 10.1038/s41598-020-59181-2.
Today's electronics cannot perform in harsh environments (e.g., elevated temperatures and ionizing radiation environments) found in many engineering applications. Based on the coupling between near-field thermal radiation and MEMS thermal actuation, we presented the design and modeling of NanoThermoMechanical AND, OR, and NOT logic gates as an alternative, and showed their ability to be combined into a full thermal adder to perform complex operations. In this work, we introduce the fabrication and characterization of the first ever documented Thermal AND and OR logic gates. The results show thermal logic operations can be achieved successfully through demonstrated and easy-to-manufacture NanoThermoMechanical logic gates.
如今的电子产品无法在许多工程应用中遇到的恶劣环境(例如,高温和电离辐射环境)下运行。基于近场热辐射和微机电系统热致动之间的耦合,我们提出了作为替代方案的纳米热机械与、或和非逻辑门的设计和建模,并展示了它们组合成全热加法器以执行复杂操作的能力。在这项工作中,我们介绍了有史以来第一个记录的热与和或逻辑门的制造和特性。结果表明,通过展示和易于制造的纳米热机械逻辑门,可以成功实现热逻辑操作。