Department of Mechanical &Materials Engineering, University of Nebraska-Lincoln, Lincoln, Nebraska 68588, United States.
Sci Rep. 2017 Mar 21;7:44901. doi: 10.1038/srep44901.
Limited performance and reliability of electronic devices at extreme temperatures, intensive electromagnetic fields, and radiation found in space exploration missions (i.e., Venus &Jupiter planetary exploration, and heliophysics missions) and earth-based applications requires the development of alternative computing technologies. In the pursuit of alternative technologies, research efforts have looked into developing thermal memory and logic devices that use heat instead of electricity to perform computations. However, most of the proposed technologies operate at room or cryogenic temperatures, due to their dependence on material's temperature-dependent properties. Here in this research, we show experimentally-for the first time-the use of near-field thermal radiation (NFTR) to achieve thermal rectification at high temperatures, which can be used to build high-temperature thermal diodes for performing logic operations in harsh environments. We achieved rectification through the coupling between NFTR and the size of a micro/nano gap separating two terminals, engineered to be a function of heat flow direction. We fabricated and tested a proof-of-concept NanoThermoMechanical device that has shown a maximum rectification of 10.9% at terminals' temperatures of 375 and 530 K. Experimentally, we operated the microdevice in temperatures as high as about 600 K, demonstrating this technology's suitability to operate at high temperatures.
在太空探索任务(如金星和木星行星探索以及日球层物理学任务)和地球应用中,极端温度、强烈电磁场和辐射会对电子设备的性能和可靠性造成限制,这需要开发替代计算技术。在寻求替代技术的过程中,研究人员致力于开发使用热量而不是电力进行计算的热存储和逻辑设备。然而,由于大多数提出的技术依赖于材料的温度相关特性,它们大多在室温或低温下运行。在这项研究中,我们首次实验证明了使用近场热辐射 (NFTR) 在高温下实现热整流,这可用于构建高温热二极管,以在恶劣环境中执行逻辑运算。我们通过 NFTR 和分隔两个端子的微/纳米间隙的大小之间的耦合来实现整流,该间隙的尺寸设计为热流方向的函数。我们制造并测试了一个概念验证的 NanoThermoMechanical 设备,该设备在 375 和 530 K 的端子温度下显示出最大 10.9%的整流效果。在实验中,我们在高达约 600 K 的温度下操作微设备,证明了该技术在高温下的适用性。