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具有类塑料延展性和类金属热导率的高负载氮化硼基仿生纸。

High-Loading Boron Nitride-Based Bio-Inspired Paper with Plastic-like Ductility and Metal-like Thermal Conductivity.

作者信息

Wang Yunjing, Xia Shuang, Xiao Guang, Di Jiangtao, Wang Jianfeng

机构信息

College of Materials Science and Engineering, Hunan University, Changsha 410082, China.

Institute of Chemical Materials, China Academy of Engineering Physics, Mianyang 621900, China.

出版信息

ACS Appl Mater Interfaces. 2020 Mar 18;12(11):13156-13164. doi: 10.1021/acsami.9b21753. Epub 2020 Mar 4.

Abstract

Although desirable in next-generation flexible electronics, fabricating hybrid film materials with excellent integration of mechanical and thermally conductive yet electrically insulating properties is still a challenge. In mollusk nacre, a small volume of the chitin nanofiber framework hosts 95 vol % CaCO microplatelets, enabling the high-loading natural composites to exhibit a ductile deformation behavior. Inspired by this, we fabricate a large-area, boron nitride-based bio-inspired paper using a facile sol-gel-film conversion approach, in which BN microplatelets with a loading of 40-80 wt % are embedded into a 3D poly(-phenylene benzobisoxazole) nanofiber framework. Because of the vital role of the 3D nanofiber framework, the BN-based paper exhibits plastic-like ductility (38-80%), ultrahigh toughness (10-100 MJ m), and good folding endurance. The high-loading BN platelets form an oriented, percolative network and endow the paper with outstanding in-plane thermal conductivity (77.1-214.2 W m K) comparable to that of some metals, such as aluminum alloys (108-230 W m K). Using the electrically insulating BN-based paper as a flexible substrate, we demonstrate its promising application for lowering the temperature of electronic devices.

摘要

尽管在下一代柔性电子器件中是理想的,但制造具有优异机械和热传导性且电绝缘性能集成的混合薄膜材料仍然是一个挑战。在软体动物的珍珠层中,少量的几丁质纳米纤维框架容纳了95体积%的碳酸钙微片,使得这种高负载天然复合材料表现出延性变形行为。受此启发,我们采用一种简便的溶胶-凝胶-薄膜转化方法制备了一种大面积的、基于氮化硼的仿生纸,其中负载量为40-80重量%的氮化硼微片被嵌入到三维聚对苯撑苯并双恶唑纳米纤维框架中。由于三维纳米纤维框架的关键作用,基于氮化硼的纸表现出类塑性延展性(38-80%)、超高韧性(10-100 MJ m)和良好的耐折叠性。高负载的氮化硼片形成一个定向的、渗流网络,并赋予纸张出色的面内热导率(77.1-214.2 W m K),与一些金属如铝合金(108-230 W m K)相当。使用基于氮化硼的电绝缘纸作为柔性基板,我们展示了其在降低电子器件温度方面的应用前景。

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