Feng Chang-Ping, Wei Fang, Sun Kai-Yin, Wang Yan, Lan Hong-Bo, Shang Hong-Jing, Ding Fa-Zhu, Bai Lu, Yang Jie, Yang Wei
Shandong Engineering Research Center for Additive Manufacturing, Qingdao University of Technology, Qingdao, 266520, People's Republic of China.
State Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu, 610065, People's Republic of China.
Nanomicro Lett. 2022 Jun 14;14(1):127. doi: 10.1007/s40820-022-00868-8.
Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed.
由于电子产品的集成度、工作频率和功率密度不断提高，有效的热管理对其而言十分迫切，而热管理的主要策略是通过导热材料将电子产品中多余的能量散发到外部。与传统热管理材料相比，具有高面内热导率的柔性导热薄膜作为新兴材料，在过去十年中引起了更大的关注，在下一代器件的热管理应用中显示出巨大潜力。然而，很少有关于柔性导热薄膜的全面综述报道。因此，我们综述了具有超高面内热导率的本征聚合物薄膜和聚合物基复合薄膜的最新进展，深入了解了传热机制、提高热导率的加工方法、降低界面热阻的优化策略及其潜在应用。最后，还讨论了柔性导热薄膜未来发展面临的挑战和机遇。
