Alibakhshikenari Mohammad, Virdee Bal S, See Chan H, Abd-Alhameed Raed A, Falcone Francisco, Limiti Ernesto
Electronic Engineering Department, University of Rome "Tor Vergata", Via del Politecnico 1, 00133, Rome, Italy.
London Metropolitan University, Center for Communications Technology & Mathematics, School of Computing & Digital Media, London, N7 8DB, UK.
Sci Rep. 2020 Mar 9;10(1):4298. doi: 10.1038/s41598-020-61099-8.
This paper presents a novel on-chip antenna using standard CMOS-technology based on metasurface implemented on two-layers polyimide substrates with a thickness of 500 μm. The aluminium ground-plane with thickness of 3 μm is sandwiched between the two-layers. Concentric dielectric-rings are etched in the ground-plane under the radiation patches implemented on the top-layer. The radiation patches comprise concentric metal-rings that are arranged in a 3 × 3 matrix. The antennas are excited by coupling electromagnetic energy through the gaps of the concentric dielectric-rings in the ground-plane using a microstrip feedline created on the bottom polyimide-layer. The open-ended feedline is split in three-branches that are aligned under the radiation elements to couple the maximum energy. In this structure, the concentric metal-rings essentially act as series left-handed capacitances C that extend the effective aperture area of the antenna without affecting its dimensions, and the concentric dielectric rings etched in the ground-plane act as shunt left-handed inductors L, which suppress the surface-waves and reduce the substrates losses that leads to improved bandwidth and radiation properties. The overall structure behaves like a metasurface that is shown to exhibit a very large bandwidth of 0.350-0.385 THz with an average radiation gain and efficiency of 8.15dBi and 65.71%, respectively. It has dimensions of 6 × 6 × 1 mm that makes it suitable for on-chip implementation.
本文提出了一种基于超表面的新型片上天线，该天线采用标准CMOS技术，在厚度为500μm的两层聚酰亚胺基板上实现。厚度为3μm的铝接地平面夹在两层之间。在顶层实现的辐射贴片下方的接地平面中蚀刻同心介质环。辐射贴片由以3×3矩阵排列的同心金属环组成。通过使用在底部聚酰亚胺层上创建的微带馈线，通过接地平面中同心介质环的间隙耦合电磁能量来激励天线。开放式馈线分为三个分支，这些分支在辐射元件下方对齐，以耦合最大能量。在这种结构中，同心金属环本质上充当串联左手电容C，可扩展天线的有效孔径面积而不影响其尺寸，并且在接地平面中蚀刻的同心介质环充当并联左手电感L，可抑制表面波并减少基板损耗，从而提高带宽和辐射特性。整体结构表现得像一个超表面，显示出非常大的带宽，为0.350 - 0.385太赫兹，平均辐射增益和效率分别为8.15dBi和65.71%。它的尺寸为6×6×1mm，适合片上实现。
