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通过每千分之一的微胶囊内碳纳米管掺杂剂增强相变材料的热缓冲性能。

Enhanced Thermal Buffering of Phase Change Materials by the Intramicrocapsule Sub per Mille CNT Dopant.

作者信息

Mikhaylov Alexey A, Sladkevich Sergey, Medvedev Alexander G, Prikhodchenko Petr V, Gun Jenny, Sakharov Konstantin A, Xu Zhichuan J, Kulish Vladimir, Nikolaev Vitaly A, Lev Ovadia

机构信息

The Institute Chemistry, The Casali Center of Applied Chemistry, The Hebrew University of Jerusalem, Edmond J. Safra Campus, Jerusalem 9190401, Israel.

Singapore HUJ Alliance Research & Enterprise, New CREATE Campus for Research Excellence and Technological Enterprise (CREATE), 1 CREATE Way, Singapore 138602, Singapore.

出版信息

ACS Appl Mater Interfaces. 2020 Apr 8;12(14):16227-16235. doi: 10.1021/acsami.9b21205. Epub 2020 Mar 26.

DOI:10.1021/acsami.9b21205
PMID:32167739
Abstract

Microencapsulation of a carbon nanotube (CNT)-loaded paraffin phase change material, PCM in a poly(melamine-formaldehyde) shell, and the respective CNT-PCM gypsum composites is explored. Although a very low level (0.001-0.1 wt %) of intramicrocapsule loading of CNT dopant does not change the thermal conductivity of the solid, it increases the measured effusivity and thermal buffering performance during phase transition. The observed effusivity of 0.05 wt % CNT-doped PCM reaches 4000 W s m K, which is higher than the reported effusivity of alumina and alumina bricks and an order of magnitude larger than the solid, CNT-free PCM powder. The CNT dopant (0.015 wt %) in a 30 wt % PCM-plaster composite improved the effusivity by 60% compared to the CNT-free composite, whereas the addition of the same amount of CNTs to the bulk of the plaster does not improve either the effusivity or the thermal buffering performance of the composite. The thermal enhancement is ascribed to a CNT network formation within the paraffin core.

摘要

研究了一种负载碳纳米管(CNT)的石蜡相变材料(PCM)在聚(三聚氰胺 - 甲醛)壳中的微胶囊化,以及相应的CNT-PCM石膏复合材料。尽管微胶囊内CNT掺杂剂的负载水平非常低(0.001 - 0.1 wt%)不会改变固体的热导率,但它会增加相变过程中测量的热扩散系数和热缓冲性能。观察到0.05 wt% CNT掺杂的PCM的热扩散系数达到4000 W s m K,高于报道的氧化铝和氧化铝砖的热扩散系数,比不含CNT的固体PCM粉末大一个数量级。30 wt% PCM - 石膏复合材料中0.015 wt%的CNT掺杂剂相比于不含CNT的复合材料使热扩散系数提高了60%,而在石膏主体中添加相同量的CNT既没有提高复合材料的热扩散系数也没有改善其热缓冲性能。热增强归因于石蜡芯内形成的CNT网络。

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