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四氮唑紫作为酸性环境中新型铜缓蚀剂的电化学研究

Electrochemical Investigation of Tetrazolium Violet as a Novel Copper Corrosion Inhibitor in an Acid Environment.

作者信息

Tao Zhihua, Liu Guanting, Li Yuanxun, Zhang Ruoyu, Su Hua, Li Sheng

机构信息

Center for Applied Chemistry, School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China.

State Key Lab of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China (UESTC), Chengdu 610054, China.

出版信息

ACS Omega. 2020 Feb 25;5(9):4415-4423. doi: 10.1021/acsomega.9b03475. eCollection 2020 Mar 10.

DOI:10.1021/acsomega.9b03475
PMID:32175489
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7066570/
Abstract

Tetrazolium violet (TZV) is an important pharmaceutical intermediate for the preparation of various medicines, taking into account microbiological studies and TZV as a new inhibitor of heterocyclic compound. The corrosion inhibiting action of TZV for copper in 0.5 M HSO solutions was assessed by potentiodynamic polarization and electrochemical impedance spectroscopy. The corroded copper surfaces were evaluated by scanning electron microscopy. Thereafter, the thermodynamics of TZV adsorption onto copper was computed and evaluated. As a result, the target TZV compound shows great corrosion inhibition performance to protect copper in sulfuric acid. Thermodynamic test results reveal that the Langmuir, Dhar-Flory-Huggins, and Bockris-Swinkels isotherm models provide a better description for the adsorption process of TZV on the metal surface. The calculated values of Δ indicate a spontaneous adsorption process of TZV on the copper surface accompanied by two kinds of interactions, physical adsorption and chemisorption.

摘要

四氮唑紫(TZV)是制备各种药物的重要医药中间体,考虑到微生物学研究以及TZV作为一种新型杂环化合物抑制剂。通过动电位极化和电化学阻抗谱评估了TZV在0.5 M硫酸溶液中对铜的缓蚀作用。通过扫描电子显微镜对腐蚀后的铜表面进行了评估。此后,计算并评估了TZV在铜上的吸附热力学。结果表明,目标TZV化合物在硫酸中对铜具有优异的缓蚀性能。热力学测试结果表明,朗缪尔、达哈-弗洛里-哈金斯和博克里斯-斯温克尔斯等温线模型能更好地描述TZV在金属表面的吸附过程。计算得到的Δ值表明TZV在铜表面的吸附过程是自发的,伴有物理吸附和化学吸附两种相互作用。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/7a62/7066570/19fd19a2fc5f/ao9b03475_0008.jpg
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Corrosion Protection of Copper Using AlO, TiO, ZnO, HfO, and ZrO Atomic Layer Deposition.
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