Han Zhijia, Gui Zhigang, Zhu Y B, Qin Peng, Zhang Bo-Ping, Zhang Wenqing, Huang Li, Liu Weishu
Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 10083, China.
Research (Wash D C). 2020 Feb 28;2020:1672051. doi: 10.34133/2020/1672051. eCollection 2020.
The optimization of thermoelectric materials involves the decoupling of the transport of electrons and phonons. In this work, an increased Mg-Mg distance, together with the carrier conduction network protection, has been shown as an effective strategy to increase the weighted mobility ( = ) and hence thermoelectric power factor of Mg Sb Bi family near room temperature. Mg SbBi has a high carrier mobility of 247 cm V s and a record power factor of 3470 W m K at room temperature. Considering both efficiency and power density, Mg SbBi with a high average ZT of 1.13 and an average power factor of 3184 W m K in the temperature range of 50-250°C would be a strong candidate to replace the conventional n-type thermoelectric material BiTeSe. The protection of the transport channel through Mg sublattice means alloying on Sb sublattice has little effect on electron while it significantly reduces phonon thermal conductivity, providing us an approach to decouple electron and phonon transport for better thermoelectric materials.
热电材料的优化涉及电子和声子传输的解耦。在这项工作中,增加的Mg-Mg间距以及载流子传导网络保护,已被证明是一种有效的策略,可提高MgSbBi族在室温附近的加权迁移率(=),从而提高其热电功率因子。MgSbBi在室温下具有247 cm²V⁻¹s⁻¹的高载流子迁移率和3470 Wm⁻¹K⁻²的创纪录功率因子。考虑到效率和功率密度,在50-250°C温度范围内具有1.13的高平均ZT和3184 Wm⁻¹K⁻²的平均功率因子的MgSbBi将是替代传统n型热电材料Bi₂Te₃Se的有力候选者。通过Mg亚晶格对传输通道的保护意味着在Sb亚晶格上合金化对电子影响很小,而它会显著降低声子热导率,为我们提供了一种使电子和声子传输解耦以获得更好热电材料的方法。