Yousefi Farrokh, Khoeini Farhad, Rajabpour Ali
Department of Physics, University of Zanjan, Zanjan 45195-313, Iran.
Nanotechnology. 2020 Apr 24;31(28):285707. doi: 10.1088/1361-6528/ab8420. Epub 2020 Mar 27.
We investigate thermal rectification and thermal resistance in a hybrid pillared-graphene and graphene (PGG) system by both molecular dynamics (MD) simulation and a continuum model. First, the thermal conductivity of both pillared-graphene and graphene is calculated by employing MD simulation and Fourier's law. Our results show that the thermal conductivity of the pillared-graphene is much smaller than that of graphene by one order of magnitude. Next, by applying positive and negative temperature gradients along the longitudinal direction of the PGG, the thermal rectification is examined. The MD results indicate that for the lengths in the range of 3686 nm, the thermal rectification remains almost constant (~3%-5%). We have also studied the phonon density of states (DOS) on both sides of the interface of PGG. The DOS curves show that there is phonon scattering at low frequencies that depends on the imposed temperature gradient direction in the system. Therefore, we can introduce the PGG as a thermal rectifier at room temperature. Furthermore, next, we also explore the temperature distribution over the PGG by using the continuum model. The results obtained from the continuum model predict the MD results, such as the temperature distribution in the upper half-layer and lower full-layer graphene, the temperature gap, and also the thermal resistance at the interface. This study could help in the design of chip coolers, and phononic devices such as thermal nanodiodes.
我们通过分子动力学(MD)模拟和连续介质模型研究了混合柱状石墨烯与石墨烯(PGG)系统中的热整流和热阻。首先,采用MD模拟和傅里叶定律计算了柱状石墨烯和石墨烯的热导率。我们的结果表明,柱状石墨烯的热导率比石墨烯小一个数量级。接下来,通过沿PGG的纵向施加正、负温度梯度,研究了热整流现象。MD结果表明,对于长度在3686 nm范围内的情况,热整流几乎保持恒定(约3%-5%)。我们还研究了PGG界面两侧的声子态密度(DOS)。DOS曲线表明,在低频处存在声子散射,这取决于系统中施加的温度梯度方向。因此,我们可以将PGG作为室温下的热整流器。此外,接下来,我们还使用连续介质模型探索了PGG上的温度分布。从连续介质模型获得的结果预测了MD结果,如上层半层和下层全层石墨烯中的温度分布、温度差以及界面处的热阻。这项研究有助于芯片冷却器以及诸如热纳米二极管等声子器件的设计。