Gatabi Zahra Rezanejad, Mohammadpour Raheleh, Gatabi Javad Rezanejad, Mirhoseini Mehri, Ahmadi Mohsen, Sasanpour Pezhman
Department of Biomedical Engineering and Medical Physics, School of Medicine, Shahid Beheshti University of Medical Sciences, Tehran, Iran.
Institute for Nanoscience and Nanotechnology, Sharif University of Technology, Tehran, Iran.
Heliyon. 2020 Apr 1;6(4):e03652. doi: 10.1016/j.heliyon.2020.e03652. eCollection 2020 Apr.
Effect of sandblasting of the copper electrode structures before deposition of gold thin film for micro electrical impedance tomography (EIT) system has been studied experimentally. The comparison has been performed on the unmodified copper electrodes and the sandblasted electrodes before deposition of gold layer, using structural analysis while their performance in EIT system has been measured and analyzed. The results of scanning electron microscopy and atomic force microscopy show that the sandblasting of the electrodes results in the deposition of gold film with smaller grain size and uniformly, comparing to the unmodified structure. The measurement of impedance shows that the sandblasting will increase the double layer capacitance of electrode structure which improves the impedance measurement accordingly.
对用于微电阻抗断层成像（EIT）系统的金薄膜沉积前铜电极结构进行喷砂处理的效果进行了实验研究。在沉积金层之前，对未改性的铜电极和经过喷砂处理的电极进行了比较，采用结构分析方法，同时测量并分析了它们在EIT系统中的性能。扫描电子显微镜和原子力显微镜的结果表明，与未改性结构相比，电极的喷砂处理导致金膜沉积的晶粒尺寸更小且更均匀。阻抗测量结果表明，喷砂处理会增加电极结构的双层电容，从而相应地改善阻抗测量。
