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基于密度泛函理论的MgSb/MgSi异质形核界面研究

Investigation on MgSb/MgSi Heterogeneous Nucleation Interface Using Density Functional Theory.

作者信息

Wang Mingjie, Zhang Guowei, Xu Hong, Fu Yizheng

机构信息

School of Materials Science and Engineering, North University of China, Shanxi 030051, China.

出版信息

Materials (Basel). 2020 Apr 3;13(7):1681. doi: 10.3390/ma13071681.

Abstract

In this study, the cohesive energy, interfacial energy, electronic structure, and bonding of MgSi (111)/MgSb (0001) were investigated by using the first-principles method based on density functional theory. Meanwhile, the mechanism of the MgSb heterogeneous nucleation potency on MgSi grains was revealed. The results indicated that the MgSb (0001) slab and the MgSi (111) slab achieved bulk-like characteristics when the atomic layers N ≥ 11, and the work of adhesion of the hollow-site (HCP) stacking structure (the interfacial Sb atom located on top of the Si atom in the second layer of MgSi) was larger than that of the other stacking structures. For the four HCP stacking structures, the Sb-terminated MgSb/Si-terminated MgSi interface with a hollow site showed the largest work of adhesion and the smallest interfacial energy, which implied the strongest stability among 12 different interface models. In addition, the difference in the charge density and the partial density of states indicated that the electronic structure of the Si-HCP-Sb interface presented a strong covalent, and the bonding of the Si-HCP-Mg interface and the Mg-HCP-Sb interface was a mixture of a covalent bond and a metallic bond, while the Mg-HCP-Mg interfacial bonding corresponded to metallicity. As a result, the MgSi was conducive to form a nucleus on the Sb-terminated-hollow-site MgSb (0001) surface, and the MgSb particles promoted the MgSi heterogeneous nucleation, which was consistent with the experimental expectations.

摘要

在本研究中,基于密度泛函理论采用第一性原理方法研究了MgSi(111)/MgSb(0001)的内聚能、界面能、电子结构和键合情况。同时,揭示了MgSb在MgSi晶粒上异质形核能力的机制。结果表明,当原子层数N≥11时,MgSb(0001)平板和MgSi(111)平板达到体相特征,且中空位点(HCP)堆积结构(界面Sb原子位于MgSi第二层的Si原子上方)的粘附功大于其他堆积结构。对于四种HCP堆积结构,具有中空位点的Sb端接MgSb/Si端接MgSi界面表现出最大的粘附功和最小的界面能,这意味着在12种不同界面模型中其稳定性最强。此外,电荷密度和态密度的差异表明,Si-HCP-Sb界面的电子结构呈现出很强的共价性,Si-HCP-Mg界面和Mg-HCP-Sb界面的键合是共价键和金属键的混合,而Mg-HCP-Mg界面键合对应于金属性。结果表明,MgSi有利于在Sb端接-中空位点MgSb(0001)表面成核,MgSb颗粒促进了MgSi的异质形核,这与实验预期一致。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/1728/7178643/b89a11304f81/materials-13-01681-g001.jpg

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