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物联网的无芯片 RFID 传感器:挑战与机遇。

Chipless RFID Sensors for the Internet of Things: Challenges and Opportunities.

机构信息

Centre for Materials and Microsystems, Fondazione Bruno Kessler, 38123 Trento, Italy.

Department of Information Engineering and Computer Science, University of Trento, 38100 Trento, Italy.

出版信息

Sensors (Basel). 2020 Apr 10;20(7):2135. doi: 10.3390/s20072135.

DOI:10.3390/s20072135
PMID:32290109
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7181130/
Abstract

Radio-frequency identification (RFID) sensors are one of the fundamental components of the internet of things that aims at connecting every physical object to the cloud for the exchange of information. In this framework, chipless RFIDs are a breakthrough technology because they remove the cost associated with the chip, being at the same time printable, passive, low-power and suitable for harsh environments. After the important results achieved with multibit chipless tags, there is a clear motivation and interest to extend the chipless sensing functionality to physical, chemical, structural and environmental parameters. These potentialities triggered a strong interest in the scientific and industrial community towards this type of application. Temperature and humidity sensors, as well as localization, proximity, and structural health prototypes, have already been demonstrated, and many other sensing applications are foreseen soon. In this review, both the different architectural approaches available for this technology and the requirements related to the materials employed for sensing are summarized. Then, the state-of-the-art of categories of sensors and their applications are reported and discussed. Finally, an analysis of the current limitations and possible solution strategies for this technology are given, together with an overview of expected future developments.

摘要

射频识别(RFID)传感器是物联网的基本组成部分之一,旨在将每个物理对象连接到云端,以交换信息。在这个框架中,无芯片 RFID 是一项突破性技术,因为它们消除了与芯片相关的成本,同时具有可打印性、无源性、低功耗性和适用于恶劣环境的特点。在多比特无芯片标签取得重要成果之后,人们明显有动力和兴趣将无芯片传感功能扩展到物理、化学、结构和环境参数。这些潜力激发了科学界和工业界对这种应用的强烈兴趣。已经演示了温度和湿度传感器以及定位、接近和结构健康原型,并且很快就会预见许多其他传感应用。在这篇综述中,总结了这项技术的不同架构方法以及与用于传感的材料相关的要求。然后,报告并讨论了各种传感器及其应用的最新技术水平。最后,对该技术的当前限制和可能的解决方案策略进行了分析,并概述了预期的未来发展。

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