Zheng Deyin, Choi Chang-Hwan, Zhao Xin, Sun Guangyi
Institute of Robotics and Automatic Information System, Nankai University, Tianjin, 300071, People's Republic of China.
Department of Mechanical Engineering, Stevens Institute of Technology, Hoboken, NJ 07030, USA.
Nanoscale. 2020 May 21;12(19):10565-10572. doi: 10.1039/d0nr01518k.
A large variety of synthetic methods have been developed for hierarchically porous materials by which the performance of a wide range of applications can be dramatically enhanced. Herein, hierarchically porous micropillar arrays are demonstrated by employing electrochemical etching to silicon micropillars. The approach relies on the steering of current flow through the three-dimensional silicon-electrolyte interface to enable nanopores to grow on the entire surface of the micropillars, simultaneously. The pores grow perpendicular to the surface of the micropillars, whereas the pore diameter and porosity vary depending on the locations of the surfaces. The finite element analysis shows that the spatial variation of the pore diameter and porosity is determined by the distribution of current density. Further, the thickness of the porous layer can be tuned by etching time so that sponge-like porous structures are conveniently obtained by regulating the etching time. In addition to the effect of current density flowing through the etched surfaces, the growth of pores also depends on the crystal orientations of the etched surfaces. The etching results on square micropillar arrays and microgroove arrays show that the growth direction and rate of nanopores inside the microstructure also depend on the exposed crystal planes. The facile characteristics of the fabrication method can serve as an effective route for a wide range of applications of porous materials with enhanced capabilities.
人们已经开发出各种各样的合成方法来制备具有分级多孔结构的材料,通过这些方法可以显著提高各种应用的性能。在此,通过对硅微柱进行电化学蚀刻,展示了分级多孔微柱阵列。该方法依赖于通过三维硅-电解质界面引导电流流动,以使纳米孔能够同时在微柱的整个表面上生长。孔垂直于微柱表面生长,而孔径和孔隙率则根据表面位置而变化。有限元分析表明,孔径和孔隙率的空间变化由电流密度分布决定。此外,多孔层的厚度可以通过蚀刻时间进行调节,从而通过调节蚀刻时间方便地获得海绵状多孔结构。除了流经蚀刻表面的电流密度的影响外,孔的生长还取决于蚀刻表面的晶体取向。对方形微柱阵列和微槽阵列的蚀刻结果表明,微观结构内部纳米孔的生长方向和速率也取决于暴露的晶面。这种制备方法的简便特性可作为一种有效途径,用于具有增强性能的多孔材料的广泛应用。