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三轴表面微机械 MEMS 振动陀螺仪的设计。

Design of a Tri-Axial Surface Micromachined MEMS Vibrating Gyroscope.

机构信息

Department of Information, Electronic and Telecomunication Engineer, Sapienza University of Roma, 00184 Rome, Italy.

Department of Mechanical and Aerospace Engineer, Sapienza University of Roma, 00184 Rome, Italy.

出版信息

Sensors (Basel). 2020 May 15;20(10):2822. doi: 10.3390/s20102822.

DOI:10.3390/s20102822
PMID:32429296
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7284569/
Abstract

Gyroscopes are one of the next killer applications for the MEMS (Micro-Electro-Mechanical-Systems) sensors industry. Many mature applications have already been developed and produced in limited volumes for the automotive, consumer, industrial, medical, and military markets. Plenty of high-volume applications, over 100 million per year, have been calling for low-cost gyroscopes. Bulk silicon is a promising candidate for low-cost gyroscopes due to its large scale availability and maturity of its manufacturing industry. Nevertheless, it is not suitable for a real monolithic IC integration and requires a dedicated packaging. New designs are supposed to eliminate the need for magnets and metal case package, and allow for a real monolithic MEMS-IC (Integrated Circuit) electronic system. In addition, a drastic cost reduction could be achieved by utilizing off-the-shelf plastic packaging with lead frames for the final assembly. The present paper puts forward the design of a novel tri-axial gyroscope based on rotating comb-drives acting as both capacitive sensors and actuators. The comb-drives are comprised of a single monolithic moving component (rotor) and fixed parts (stators). The former is made out of different concentrated masses connected by curved silicon beams in order to decouple the motion signals. The sensor was devised to be fabricated through the PolyMUMPs process and it is intended for working in air in order to semplify the MEMS-IC monolithic integration.

摘要

陀螺仪是 MEMS（微机电系统）传感器行业的下一个杀手级应用之一。许多成熟的应用已经在有限的数量下为汽车、消费、工业、医疗和军事市场开发和生产。大量的高容量应用，每年超过 1 亿个，都在呼吁低成本的陀螺仪。由于其大规模可用性和制造业的成熟度，体硅是低成本陀螺仪的有前途的候选者。然而，它不适合真正的单片 IC 集成，需要专用的封装。新的设计旨在消除对磁铁和金属外壳封装的需求，并允许真正的单片 MEMS-IC（集成电路）电子系统。此外，通过利用最终组装用带有引线框架的现成塑料封装，可以实现大幅降低成本。本文提出了一种基于旋转梳状驱动器的新型三轴陀螺仪设计，该驱动器既可用作电容传感器，也可用作致动器。梳状驱动器由单个单片移动部件（转子）和固定部件（定子）组成。前者由通过弯曲硅梁连接的不同集中质量组成，以解耦运动信号。该传感器被设计为通过 PolyMUMPs 工艺制造，旨在在空气中工作，以简化 MEMS-IC 单片集成。

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