Canino Marica, Fedeli Paolo, Albonetti Cristiano, Nipoti Roberta
Institute for Microelectronics and Microsystems IMM Bologna Unit, National Research Council of Italy (CNR), Via Piero Gobetti 101, Bologna, 40129, Italy.
Institute for the Study on Nanostructured Materials ISMN, National Research Council of Italy (CNR), Via Piero Gobetti 101, Bologna, 40129, Italy.
J Microsc. 2020 Dec;280(3):229-240. doi: 10.1111/jmi.12933. Epub 2020 Jun 19.
The root mean square (rms) surface roughness extracted from atomic force microscopy is widely employed to complement the characterisation of ion implantation processes in 4H-SiC. It is known that the protection of a carbon film eliminates or mitigates roughening of the SiC surface during postimplantation annealing. This study, based on a rich original data collection of Al ion implanted 4H-SiC samples, allows for a quantitative description of the surface morphology as a function of the annealing temperature and time and of the Al implanted concentration. With increasing thermal budget, the evolution from flat, to blurred with ripples, granular, and finally jagged surface, results in a monotonous increase in the root mean square roughness. Additional information is given by the trends of the roughness exponent and of the correlation length, extracted from the height-height correlation function, which account for the surface evolution below 1700°C and for the effect of the Al implanted concentration on the ripple size, respectively. A combination of low roughness parameter and high correlation length identify the transition from ripples to jagged morphology. LAY DESCRIPTION: Selective area doping is a key step in the fabrication of hexagonal Silicon Carbide (4H-SiC) power electronic devices. It is achieved by ion implantation followed by a high temperature postimplantation annealing to restore the lattice and electrically activate the dopants. Aluminium, the preferred p-type dopant, is electrically activated at temperature ranging between 1500°C and 2000°C. The time required to complete the activation process is longer the lower the annealing temperature, spanning between some minutes and hundreds of hours. During annealing, 4H-SiC wafers are encapsulated by a temperature-resistant carbon layer (C-cap) in order to avoid step bunching and reduce surface roughening. Nevertheless, surface modifications can occur at high temperature. For this reason, the characterisations of 4H-SiC doping processes report not only the electrical activation of the dopants, but also the root mean square surface roughness obtained at the end of the process. However, rms values can be scattered because technological parameters such as the heating system and the way to deposit and remove the C-cap can affect the final result as well as the process parameters. Furthermore, the C-cap resistance to long annealing has been proven only by electrical measurements, but the surface morphology has never been observed. This work presents a quantitative characterisation of the surface morphology of Al implanted 4H-SiC as a function of the annealing temperature, time and of the Al implanted concentration, independent of the heating system and of the C-cap technology. The produced sample collection allowed to correlate characteristic surface features with the corresponding quantities extracted from image analysis that can be more sensitive to process parameters than the sole rms. These findings can be used to enrich process optimisation tools.
从原子力显微镜提取的均方根(rms)表面粗糙度被广泛用于补充4H-SiC中离子注入过程的表征。众所周知,碳膜的保护可消除或减轻注入后退火过程中SiC表面的粗糙度增加。本研究基于大量Al离子注入4H-SiC样品的原始数据,能够定量描述表面形貌随退火温度、时间以及Al注入浓度的变化。随着热预算的增加,表面从平整逐渐演变为带有波纹、颗粒状,最终变为锯齿状,导致均方根粗糙度单调增加。从高度-高度相关函数提取的粗糙度指数和相关长度的趋势分别给出了额外信息,前者解释了1700°C以下的表面演变,后者解释了Al注入浓度对波纹尺寸的影响。低粗糙度参数和高相关长度的组合确定了从波纹到锯齿状形貌的转变。
选择性区域掺杂是制造六方碳化硅(4H-SiC)功率电子器件的关键步骤。它通过离子注入,然后进行高温注入后退火以恢复晶格并电激活掺杂剂来实现。铝作为首选的p型掺杂剂,在1500°C至2000°C的温度范围内被电激活。退火温度越低,完成激活过程所需的时间越长,从几分钟到数百小时不等。在退火过程中,4H-SiC晶片被耐高温碳层(C帽)封装,以避免台阶聚集并减少表面粗糙度增加。然而,高温下仍可能发生表面改性。因此,4H-SiC掺杂过程的表征不仅报告了掺杂剂的电激活情况,还报告了过程结束时获得的均方根表面粗糙度。然而,均方根值可能会分散,因为诸如加热系统以及沉积和去除C帽的方式等工艺参数会影响最终结果以及过程参数。此外,C帽对长时间退火的耐受性仅通过电学测量得到证实,但从未观察到其表面形貌。这项工作给出了Al注入4H-SiC表面形貌随退火温度、时间以及Al注入浓度的定量表征,与加热系统和C帽技术无关。所制备的样品集使得能够将特征表面特征与从图像分析中提取的相应量相关联,这些量可能比单独的均方根对工艺参数更敏感。这些发现可用于丰富工艺优化工具。