Kamiński Maciej, Król Krystian, Kwietniewski Norbert, Myśliwiec Marcin, Sochacki Mariusz, Stonio Bartłomiej, Kisiel Ryszard, Martychowiec Agnieszka, Racka-Szmidt Katarzyna, Werbowy Aleksander, Żelazko Jarosław, Niedzielski Piotr, Szmidt Jan, Strójwąs Andrzej
Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, 75 Koszykowa Str., 00-662 Warsaw, Poland.
Łukasiewicz Research Network-Institute of Microelectronics and Photonics, 32/46 Al. Lotników, 02-668 Warsaw, Poland.
Materials (Basel). 2024 Dec 24;18(1):12. doi: 10.3390/ma18010012.
Arguably, SiC technology is the most rapidly expanding IC manufacturing technology driven mostly by the aggressive roadmap for battery electric vehicle penetration and also industrial high-voltage/high-power applications. This paper provides a comprehensive overview of the state of the art of SiC technology focusing on the challenges starting from the difficult and lengthy SiC substrate growth all the way to the complex MOSFET assembly processes. We focus on the differentiation from the established Si manufacturing processes and provide a comprehensive list of references as well as a brief description of our own research into the key manufacturing processes in this technology. We also present a SiC technology and product roadmap.
可以说,碳化硅(SiC)技术是发展最为迅速的集成电路制造技术,这主要得益于电池电动汽车普及的激进路线图以及工业高压/高功率应用。本文全面概述了SiC技术的现状,重点关注从困难且漫长的SiC衬底生长到复杂的MOSFET组装工艺等一系列挑战。我们着重阐述了与成熟的硅制造工艺的差异,提供了一份全面的参考文献列表,并简要介绍了我们自己对该技术关键制造工艺的研究。我们还展示了一份SiC技术和产品路线图。