Chemistry Division, Brookhaven National Laboratory, Upton New York 11973, United States.
Department of Chemical and Biomolecular Engineering, Case Western Reserve University, 10900 Euclid Avenue, Cleveland Ohio 44106, United States.
J Phys Chem B. 2020 Jul 2;124(26):5465-5475. doi: 10.1021/acs.jpcb.0c02735. Epub 2020 Jun 18.
We report on the effect of the substrate on electrochemical deposition of Cu from deep eutectic solvent ethaline. We investigated the polarization behavior during electrodeposition of Cu on Pt and glassy carbon (GC) from both Cu and Cu containing ethaline using cyclic voltammetry (CV). Formation of bulk Cu deposits on both substrates underwent nucleation and growth processes; however, the nucleation was considerably sluggish on GC compared to Pt. While experiments in Cu solutions indicated that coalescence of Cu islands on Pt is a slow process and that its surface may not be fully covered by Cu, such determination of Cu coverage could not be made on GC. Cu dissolution is also slower from GC than from Pt. It was observed that CV of Cu deposition on GC is influenced by the surface preparation method. Since ethaline has high chloride concentration, a parallel study in aqueous 3 M NaCl solution was conducted in order to examine the influence of the chloride medium on the electrodeposition process. This revealed that electrodeposition in both media occurred in the same manner but with different charge and mass transfer rates caused by the differences in viscosity and chloride concentrations of the two solutions.
我们报告了基底对乙腈深共晶溶剂中电化学沉积铜的影响。我们使用循环伏安法（CV）研究了从纯铜和含铜乙腈在 Pt 和玻璃碳（GC）上电沉积铜的极化行为。在这两种基底上形成块状铜沉积物都经历了形核和生长过程；然而，与 Pt 相比，GC 上的形核过程相当缓慢。虽然在 Cu 溶液中的实验表明，Pt 上 Cu 岛的合并是一个缓慢的过程，其表面可能没有完全被 Cu 覆盖，但不能在 GC 上确定 Cu 的覆盖率。Cu 从 GC 上的溶解也比从 Pt 上慢。观察到，GC 上 Cu 沉积的 CV 受到表面制备方法的影响。由于乙腈具有高氯化物浓度，因此进行了在 3 M NaCl 水溶液中的平行研究，以检查氯化物介质对电沉积过程的影响。这表明，两种介质中的电沉积以相同的方式发生，但由于两种溶液的粘度和氯化物浓度的差异，导致电荷和质量转移速率不同。
