Gui Handong, Chen Ruirui, Niu Jiahao, Zhang Zheyu, Tolbert Leon M, Wang Fei Fred, Blalock Benjamin J, Costinett Daniel, Choi Benjamin B
Department of Electrical Engineering and Computer Science, The University of Tennessee, Knoxville, TN 37996 USA.
Zucker Family Graduate Education Center, Clemson University Restoration Institute, North Charleston, SC 29405 USA.
IEEE Trans Power Electron. 2020 May;35(5):5144-5156. doi: 10.1109/tpel.2019.2944781. Epub 2019 Oct 2.
In order to apply power electronics systems to applications such as superconducting systems under cryogenic temperatures, it is necessary to investigate the characteristics of different parts in the power electronics systems. This paper reviews the influence of cryogenic temperature on power semiconductor devices including Si and wide bandgap switches, integrated circuits, passive components, interconnection and dielectric materials, and some typical cryogenic converter systems. Also, the basic theories and principles are given to explain the trends for different aspects of cryogenically cooled converters. Based on the review, Si active power devices, bulk CMOS based integrated circuits, nanocrystalline and amorphous magnetic cores, NP0 ceramic and film capacitors, thin/metal film and wirewound resistors are the components suitable for cryogenic operation. Pb-rich PbSn solder or In solder, classic PCB material, most insulation papers and epoxy encapsulant are good interconnection and dielectric parts for cryogenic temperatures.
为了将电力电子系统应用于诸如低温超导系统等应用中,有必要研究电力电子系统中不同部件的特性。本文综述了低温对功率半导体器件(包括硅和宽带隙开关)、集成电路、无源元件、互连和介电材料以及一些典型低温转换器系统的影响。此外,还给出了基本理论和原理来解释低温冷却转换器不同方面的趋势。基于该综述,硅有源功率器件、基于体CMOS的集成电路、纳米晶和非晶磁芯、NP0陶瓷和薄膜电容器、薄膜/金属薄膜和绕线电阻器是适合低温运行的部件。富铅的PbSn焊料或铟焊料、经典的印刷电路板材料、大多数绝缘纸和环氧密封剂是适合低温的良好互连和介电部件。