School of Dentistry (ODT), Universidade Federal de Santa Catarina (UFSC), Florianópolis, Santa Catarina, Brazil.
Institute of Biomedical Engineering, Universidade Federal de Santa Catarina (UFSC), Florianópolis, Santa Catarina, Brazil.
Comput Methods Biomech Biomed Engin. 2020 Nov;23(14):1041-1051. doi: 10.1080/10255842.2020.1785437. Epub 2020 Jun 27.
The aim of this study was to evaluate the influence of different density and amplitude of electric current on the percentage of bone-implant contact (BIC) using the finite element method.
Numerical models were performed on commercially pure titanium grade IV implants connected to a 1.5 V battery with an electrical resistance () at 150 kΩ on 10 µA or at 75 kΩ on 20 µA. The percentage of simulated BIC was analysed by varying the electric current from 1 up to 60 µA. The variation of electric current application was simulated for coronal and apical peri-implant regions.
The findings showed that a direct and constant electric current source below 10 μA does not provide a proper current density for osseointegration (BIC < 55%). Electric current sources ranging from 10 to 20 μA resulted in an increase in BIC above 60% while BIC reached 90% on 30 to 40 μA. Also, the application of the current source on 20 μA at the apical peri-implant region resulted in a high BIC percentage at around 86.1%.
The location and intensity of the electrical current source can increase the resultant electrical current density at the implant-bone interface and enhance the bone healing process. Although the model is a simplified version of the biological process in the bone-implant interface, such findings can predict a magnitude of electrical current density required to stimulate osseointegration.
本研究旨在通过有限元法评估不同电流密度和幅度对骨-种植体接触（BIC）百分比的影响。
对商业纯钛四级植入物进行数值模型分析，该植入物与 1.5V 电池相连，电阻为 150kΩ 时电流为 10µA，电阻为 75kΩ 时电流为 20µA。通过将电流从 1 增加到 60µA 来分析模拟 BIC 的百分比。模拟了电流应用在冠状和根尖种植体周围区域的变化。
研究结果表明，低于 10μA 的直接恒定电流源不能为骨整合提供适当的电流密度（BIC<55%）。电流源在 10 至 20μA 范围内会导致 BIC 增加到 60%以上，而在 30 至 40μA 时 BIC 达到 90%。此外，在根尖种植体周围区域应用 20μA 的电流源会导致 BIC 百分比达到 86.1%左右。
电流源的位置和强度可以增加植入物-骨界面的电流密度，并增强骨愈合过程。尽管该模型是骨-植入物界面生物过程的简化版本，但这些发现可以预测刺激骨整合所需的电流密度幅度。
