Liu Shaohong, Liu Hairui, Zhou Limin, Cui Hao, Liu Manmen, Chen Li, Wen Ming, Dong Haigang, Liu Feng, Wang Wei, Li Song
Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Materials Science and Engineering, Northeastern University, Shenyang 110819, China.
State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Yunnan Precious Metals Laboratory Co., Ltd., Kunming 650106, China.
Materials (Basel). 2024 Aug 2;17(15):3812. doi: 10.3390/ma17153812.
A novel AgCuTi brazing foil with a unique microstructure was developed, which could achieve strong vacuum brazing of Ti6Al4V (TC4) and sapphire. The brazing foil was composed of Ag solid solution (Ag(s,s)), Cu solid solution (Cu(s,s)), and layered Ti-rich phases, and had a low liquidus temperature of 790 °C and a narrow melting range of 16 °C, facilitating the defect-free joining of TC4 and sapphire. The sapphire/TC4 joint fabricated by using this novel AgCuTi brazing foil exhibited an outstanding average shear strength of up to 132.2 MPa, which was the highest value ever reported. The sapphire/TC4 joint had a characteristic structure, featuring a brazing seam reinforced by TiCu particles and a thin Ti(Cu,Al)O reaction layer of about 1.3 μm. The fracture mechanism of the sapphire/TC4 joint was revealed. The crack originated at the brazing seam with TiCu particles, then propagated through the Ti(Cu,Al)O reaction layer, detached the reaction layer from the sapphire, and finally penetrated into the sapphire. This study offers valuable insights into the design of active brazing alloys and reliable metal-ceramic bonding.
开发出了一种具有独特微观结构的新型AgCuTi钎焊箔,其能够实现Ti6Al4V(TC4)与蓝宝石的强真空钎焊。该钎焊箔由Ag固溶体(Ag(s,s))、Cu固溶体(Cu(s,s))和富Ti层状相组成,液相线温度低至790℃,熔化范围窄至16℃,有利于TC4与蓝宝石的无缺陷连接。采用这种新型AgCuTi钎焊箔制备的蓝宝石/TC4接头表现出高达132.2MPa的出色平均剪切强度,这是有史以来报道的最高值。蓝宝石/TC4接头具有一种特征结构,其钎缝由TiCu颗粒增强,还有一层约1.3μm厚的薄Ti(Cu,Al)O反应层。揭示了蓝宝石/TC4接头的断裂机制。裂纹起源于含有TiCu颗粒的钎缝,然后穿过Ti(Cu,Al)O反应层,使反应层与蓝宝石分离,最终穿透蓝宝石。该研究为活性钎焊合金的设计和可靠的金属-陶瓷结合提供了有价值的见解。