Ma Tieying, Wang Jiachen, Li Dabo
College of Optical and Electronic Technology, China Jiliang University, Hangzhou 310013, China.
Micromachines (Basel). 2020 Aug 10;11(8):764. doi: 10.3390/mi11080764.
To create approximately spherical structures with curved sidewalls, this paper presents a method for building a series of decreasing slopes along the sidewall of a circular truncated cone. The multistep ring-edge etching technology of first reducing the concentric mask and then cutting the top off to create a mesa shape can be used to form the slopes. This wet-etching method avoids the constraints of crystallographic properties with surfactant-added Tetramethylammonium hydroxide (TMAH), enabling the manufacture of successive given inclination angles, the precise modulation of the spherical curvature by reduction design of concentric masks, and the setting of etching time. The newly approximated spherical Si microstructure patterns can be used for microlenses, quartz crystal resonators, micropulleys, and other applications. The present research is an approach to fabricate advanced microelectromechanical systems (MEMS) curved-surface structures, extending the range of 3D structures fabricated by silicon wet etching.
为了创建具有弯曲侧壁的近似球形结构，本文提出了一种沿圆台侧壁构建一系列递减斜率的方法。可以使用先减小同心掩膜然后切除顶部以形成台面形状的多步环形边缘蚀刻技术来形成斜率。这种湿法蚀刻方法避免了添加表面活性剂的四甲基氢氧化铵（TMAH）对晶体学特性的限制，能够制造连续的给定倾斜角度，通过同心掩膜的缩减设计精确调制球形曲率，并设置蚀刻时间。新的近似球形硅微结构图案可用于微透镜、石英晶体谐振器、微滑轮等应用。本研究是一种制造先进微机电系统（MEMS）曲面结构的方法，扩展了通过硅湿法蚀刻制造的3D结构的范围。
