Gong Yan, Liu Wentai, Wang Runyu, Brauer Matthew Harris, Zheng Kristine, Li Wen
Department of Electrical and Computer Engineering, Michigan State University, East Lasing, MI 48824, USA.
Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
Micromachines (Basel). 2020 Aug 26;11(9):810. doi: 10.3390/mi11090810.
Reliable packaging for implantable neural prosthetic devices in body fluids is a long-standing challenge for devices' chronic applications. This work studied the stability of Parylene C (PA), SiO, and SiN packages and coating strategies on tungsten wires using accelerated, reactive aging tests in three solutions: pH 7.4 phosphate-buffered saline (PBS), PBS + 30 mM HO, and PBS + 150 mM HO. Different combinations of coating thicknesses and deposition methods were studied at various testing temperatures. Analysis of the preliminary data shows that the pinholes/defects, cracks, and interface delamination are the main attributes of metal erosion and degradation in reactive aging solutions. Failure at the interface of package and metal is the dominating factor in the wire samples with open tips.
对于可植入神经假体装置在体液中的可靠封装,是该装置长期应用面临的一项长期挑战。这项工作通过在三种溶液(pH 7.4磷酸盐缓冲盐水(PBS)、PBS + 30 mM H₂O₂和PBS + 150 mM H₂O₂)中进行加速反应老化测试,研究了聚对二甲苯C(PA)、SiO和SiN封装以及钨丝涂层策略的稳定性。在不同测试温度下研究了涂层厚度和沉积方法的不同组合。初步数据分析表明,针孔/缺陷、裂纹和界面分层是反应老化溶液中金属腐蚀和降解的主要特征。在开放尖端的导线样品中,封装与金属界面处的失效是主导因素。