IEEE Trans Biomed Eng. 2013 Oct;60(10):2943-51. doi: 10.1109/TBME.2013.2266542. Epub 2013 Jun 6.
We present an encapsulation scheme that combines atomic layer deposited (ALD) Al₂O₃ and Parylene C for the encapsulation of implantable devices. The encapsulation performances of combining alumina and Parylene C was compared to individual layers of Parylene C or alumina and the bilayer coating had superior encapsulation properties. The alumina-Parylene coated interdigitated electrodes (IDEs) soaked in PBS for up to nine months at temperatures from 37 to 80 °C for accelerated lifetime testing. For 52-nm alumina and 6-μm Parylene C, leakage current was ∼20 pA at 5 VDC, and the impedance was about 3.5 MΩ at 1 kHz with a phase near -87° from electrochemical impedance spectroscopy for samples soaked at 67 °C for equivalent lifetime of 72 months at 37 °C. The change of impedance during the whole soaking period (up to 70 months of equivalent soaking time at 37 °C) over 1 to 10⁶ Hz was within 5%. The stability of impedance indicated almost no degradation of the encapsulation. Bias voltage effect was studied by continuously applying 5 VDC, and it reduced the lifetime of Parylene coating by ∼75% while it showed no measurable effect on the bilayer coating. Lifetime of encapsulation of IDEs with topography generated by attaching a coil and surface mount device (SMD) capacitor was about half of that of planer IDEs. The stable long-term insulation impedance, low leakage current, and better lifetime under bias voltage and topography made this double-layer encapsulation very promising for chronic implantable devices.
我们提出了一种封装方案,该方案结合原子层沉积(ALD)Al₂O₃和 Parylene C 对植入式器件进行封装。将氧化铝和 Parylene C 结合的封装性能与单独的 Parylene C 或氧化铝层进行了比较,双层涂层具有更好的封装性能。氧化铝-Parylene 涂层的叉指电极(IDE)在 PBS 中浸泡长达九个月,温度从 37 到 80°C,以进行加速寿命测试。对于 52-nm 的氧化铝和 6-μm 的 Parylene C,在 5VDC 下漏电流约为 20 pA,在 1 kHz 下阻抗约为 3.5 MΩ,电化学阻抗谱的相位接近-87°,在 67°C 下浸泡等效寿命为 72 个月,在 37°C 下浸泡等效寿命为 72 个月。在整个浸泡期间(在 37°C 下浸泡等效时间长达 70 个月),阻抗的变化在 1 到 10⁶ Hz 之间不超过 5%。阻抗的稳定性表明封装几乎没有降解。通过连续施加 5VDC 研究了偏置电压效应,它使 Parylene 涂层的寿命缩短了约 75%,而对双层涂层没有可测量的影响。具有线圈和表面贴装器件(SMD)电容器附着产生的形貌的 IDE 的封装寿命约为平面 IDE 的一半。稳定的长期绝缘阻抗、低漏电流以及在偏置电压和形貌下更好的寿命使这种双层封装非常有前途,可用于慢性植入式器件。